EP4SGX530KH40I4

IC FPGA 744 I/O 1517HBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 28033024 531200 1517-BBGA, FCBGA

Quantity 399 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530KH40I4 – Stratix® IV GX Field Programmable Gate Array (FPGA), 531,200 Logic Elements

The EP4SGX530KH40I4 is a Stratix IV GX FPGA in a high-density FCBGA package designed for industrial applications that require substantial programmable logic, embedded memory, and extensive I/O. Built on the Stratix IV device family, this device delivers a combination of large logic capacity, on-chip RAM, and a comprehensive feature set documented in the Stratix IV Device Handbook.

Typical use cases include high-density digital signal processing, communications and networking functions, and complex control or prototyping systems where large programmable resources and robust thermal and electrical operating ranges are required.

Key Features

  • High Logic Capacity — 531,200 logic elements to implement large-scale custom logic, state machines, and datapaths.
  • Embedded Memory — Approximately 28 Mbits of embedded memory for buffering, lookup tables, and on-chip storage.
  • Extensive I/O — 744 user I/O pins to support dense peripheral, interface, and mezzanine connectivity.
  • Package and Mounting — 1517-BBGA FCBGA package (supplier device package: 1517-HBGA, 42.5 × 42.5 mm) with surface-mount mounting for compact board integration.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to support demanding thermal environments.
  • Core Supply — Core voltage supply specified from 870 mV to 930 mV for defined power and timing operation.
  • Industry Documentation — Device-level specifications and feature descriptions are provided in the Stratix IV Device Handbook, including sections on DC and switching characteristics, PLL specifications, DSP blocks, transceiver performance, TriMatrix memory blocks, configuration and JTAG, and power consumption.
  • Regulatory — RoHS compliant.

Typical Applications

  • High-performance signal processing — Implement complex DSP algorithms and streaming datapaths using the device’s large logic fabric and embedded memory.
  • Communications and networking — Leverage extensive I/O and documented transceiver and clocking resources from the device handbook for protocol bridging and packet processing.
  • Industrial control and automation — Use the industrial temperature rating and high I/O count for robust, tightly integrated control systems and sensor interfaces.
  • Prototyping and system integration — Large logic capacity and on-chip memory make the device suitable for validating complex SoC functions and hardware acceleration blocks.

Unique Advantages

  • Large programmable fabric: 531,200 logic elements provide room for complex state machines, custom accelerators, and large-scale glue logic, reducing the need for multiple devices.
  • Significant on-chip memory: Approximately 28 Mbits of embedded RAM supports deep buffers, FIFOs, and local data storage, minimizing external memory dependency.
  • High I/O density: 744 I/O pins enable direct connection to multiple peripherals, interfaces, and mezzanine modules without extensive multiplexing.
  • Industrial-grade thermal range: −40 °C to 100 °C operation supports deployment in demanding environments where extended temperature performance is required.
  • Well-documented architecture: Supported by the Stratix IV Device Handbook covering power, timing, PLLs, DSP blocks, transceivers, and configuration details for engineering confidence.
  • Compact FCBGA packaging: 1517-BBGA (1517-HBGA supplier package) allows high-density board layouts while maintaining thermal and mechanical reliability for surface-mount assembly.

Why Choose EP4SGX530KH40I4?

The EP4SGX530KH40I4 combines high logic capacity, substantial embedded memory, and a broad complement of I/O in an industrial-grade Stratix IV GX device. Its documented family-level features—including PLLs, DSP resources, transceiver performance specifications, and TriMatrix memory blocks—make it a strong choice for engineering teams implementing complex signal processing, communications, or control applications that demand on-chip integration and predictable operating characteristics.

Designed for engineers and system designers who require scalability and robust documentation, this FPGA is suitable for projects that need dense programmable resources, flexible interfacing, and industrial temperature operation backed by comprehensive device handbook specifications.

Request a personalized quote or submit a pricing inquiry to evaluate EP4SGX530KH40I4 for your next design.

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