EP4SGX530NF45C2

IC FPGA 920 I/O 1932FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 28033024 531200 1932-BBGA, FCBGA

Quantity 1,441 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O920Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530NF45C2 – Stratix® IV GX Field Programmable Gate Array (FPGA) IC, 1932-BBGA

The EP4SGX530NF45C2 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC designed for high-density, configurable digital logic implementations. With a large logic element count, substantial on-chip RAM, and an extensive I/O complement, this commercial-grade FPGA targets complex, I/O-rich designs where integration and resource density matter.

Key Features

  • Logic Capacity — 531,200 logic elements to implement large-scale programmable logic functions and complex custom datapaths.
  • Embedded Memory — Approximately 28 Mbits of on-chip RAM for buffering, temporary storage, and memory-intensive functions.
  • I/O Resources — 920 I/O pins to support multiple external interfaces and high fanout connectivity.
  • Core Power — Core voltage supply range of 870 mV to 930 mV to match system power rails and enable stable device operation within specified limits.
  • Package and Mounting — 1932-BBGA (FCBGA) package with supplier device package listed as 1932-FBGA, FC (45×45); surface-mount mounting for compact PCB integration.
  • Temperature and Grade — Commercial grade device with an operating temperature range of 0°C to 85°C for standard commercial environments.
  • Environmental Compliance — RoHS compliant to meet environmental regulatory requirements for lead-free assembly.

Typical Applications

  • High-density logic systems — Implement complex programmable logic and custom processing pipelines using the device's large logic element count.
  • Memory-intensive designs — Use the approximately 28 Mbits of embedded RAM for on-chip buffering, frame storage, or FIFO implementations.
  • I/O-heavy interfaces — Integrate multiple external peripherals and interfaces leveraging 920 available I/O pins.
  • Commercial electronic products — Deploy in commercial-grade applications that operate within the 0°C to 85°C temperature range and require RoHS compliance.

Unique Advantages

  • High integration density: 531,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing system BOM and board area.
  • Significant on-chip memory: Approximately 28 Mbits of RAM reduces dependence on external memory devices for many buffering and storage tasks.
  • Extensive external connectivity: 920 I/O pins simplify system integration and reduce the need for external I/O expanders.
  • Surface-mount BGA packaging: 1932-BBGA/FBGA package supports compact, high-density PCB layouts suitable for space-constrained designs.
  • Commercial operating range: Rated for 0°C to 85°C operation to match typical commercial product requirements.
  • RoHS compliant: Facilitates lead-free manufacturing and broader regulatory acceptance.

Why Choose EP4SGX530NF45C2?

The EP4SGX530NF45C2 positions itself as a high-resource, commercially graded Stratix IV GX FPGA suited for designers needing substantial logic capacity, large on-chip memory, and extensive I/O in a compact BGA package. Its combination of 531,200 logic elements, approximately 28 Mbits of embedded RAM, and 920 I/O makes it appropriate for complex, I/O-rich commercial designs that prioritize integration and board-space efficiency.

For teams building scalable, resource-intensive digital systems within standard commercial temperature ranges, this FPGA offers a clear specification set for evaluating integration, power, and packaging trade-offs during design and production planning.

Request a quote or submit a pricing and availability inquiry to receive product-specific pricing and lead-time information.

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