EP4SGX530NF45C2
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 28033024 531200 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,441 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 920 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530NF45C2 – Stratix® IV GX Field Programmable Gate Array (FPGA) IC, 1932-BBGA
The EP4SGX530NF45C2 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC designed for high-density, configurable digital logic implementations. With a large logic element count, substantial on-chip RAM, and an extensive I/O complement, this commercial-grade FPGA targets complex, I/O-rich designs where integration and resource density matter.
Key Features
- Logic Capacity — 531,200 logic elements to implement large-scale programmable logic functions and complex custom datapaths.
- Embedded Memory — Approximately 28 Mbits of on-chip RAM for buffering, temporary storage, and memory-intensive functions.
- I/O Resources — 920 I/O pins to support multiple external interfaces and high fanout connectivity.
- Core Power — Core voltage supply range of 870 mV to 930 mV to match system power rails and enable stable device operation within specified limits.
- Package and Mounting — 1932-BBGA (FCBGA) package with supplier device package listed as 1932-FBGA, FC (45×45); surface-mount mounting for compact PCB integration.
- Temperature and Grade — Commercial grade device with an operating temperature range of 0°C to 85°C for standard commercial environments.
- Environmental Compliance — RoHS compliant to meet environmental regulatory requirements for lead-free assembly.
Typical Applications
- High-density logic systems — Implement complex programmable logic and custom processing pipelines using the device's large logic element count.
- Memory-intensive designs — Use the approximately 28 Mbits of embedded RAM for on-chip buffering, frame storage, or FIFO implementations.
- I/O-heavy interfaces — Integrate multiple external peripherals and interfaces leveraging 920 available I/O pins.
- Commercial electronic products — Deploy in commercial-grade applications that operate within the 0°C to 85°C temperature range and require RoHS compliance.
Unique Advantages
- High integration density: 531,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing system BOM and board area.
- Significant on-chip memory: Approximately 28 Mbits of RAM reduces dependence on external memory devices for many buffering and storage tasks.
- Extensive external connectivity: 920 I/O pins simplify system integration and reduce the need for external I/O expanders.
- Surface-mount BGA packaging: 1932-BBGA/FBGA package supports compact, high-density PCB layouts suitable for space-constrained designs.
- Commercial operating range: Rated for 0°C to 85°C operation to match typical commercial product requirements.
- RoHS compliant: Facilitates lead-free manufacturing and broader regulatory acceptance.
Why Choose EP4SGX530NF45C2?
The EP4SGX530NF45C2 positions itself as a high-resource, commercially graded Stratix IV GX FPGA suited for designers needing substantial logic capacity, large on-chip memory, and extensive I/O in a compact BGA package. Its combination of 531,200 logic elements, approximately 28 Mbits of embedded RAM, and 920 I/O makes it appropriate for complex, I/O-rich commercial designs that prioritize integration and board-space efficiency.
For teams building scalable, resource-intensive digital systems within standard commercial temperature ranges, this FPGA offers a clear specification set for evaluating integration, power, and packaging trade-offs during design and production planning.
Request a quote or submit a pricing and availability inquiry to receive product-specific pricing and lead-time information.

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