EP4SGX530NF45C3

The EP4SGX530NF45C3 is a Stratix® IV GX field programmable gate array (FPGA) from Intel, offering 531,200 logic elements and approximately 28 Mbits of embedded memory. This device targets designs that require large on-chip logic capacity, substantial embedded RAM, and a high I/O count in a surface-mount FCBGA package.

With 920 I/O pins, a supply range of 870 mV to 930 mV, and commercial-grade operation from 0 °C to 85 °C, the EP4SGX530NF45C3 is suited for complex digital processing, I/O-dense systems, and applications where a high-density FPGA in a 1932-BBGA footprint is required.

Key Features

• Core Architecture  Stratix IV GX family FPGA core in the EP4SGX530NF45C3 package providing high logic capacity for complex designs.
• Logic Capacity  531,200 logic elements to implement large-scale digital designs and parallel processing pipelines.
• Embedded Memory  Approximately 28 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive functions.
• I/O Density  920 I/O pins to support high-channel-count interfaces, extensive external peripherals, and complex board-level connectivity.
• Power  Core supply range of 870 mV to 930 mV to match system power delivery and design requirements.
• Package & Mounting  1932-BBGA FCBGA package (45 × 45 mm supplier package) optimized for surface-mount PCB assembly and high-density board layouts.
• Operating Conditions  Commercial grade operation from 0 °C to 85 °C for standard commercial and enterprise applications.
• Compliance  RoHS compliant.

Typical Applications

• High-density logic systems  Implement large custom digital functions and parallel processing architectures using 531,200 logic elements.
• Memory-centric designs  Use the approximately 28 Mbits of embedded RAM for buffering, packet storage, or LUT-based implementations.
• I/O-rich systems  Handle many external interfaces or multi-channel I/O subsystems with 920 available I/O pins.
• Board-level integration  Integrate a high-capacity FPGA in compact PCBs using the 1932-BBGA FCBGA surface-mount package.

Unique Advantages

• Large logic fabric: 531,200 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing component count.
• Substantial on-chip memory: Approximately 28 Mbits of embedded RAM supports data buffering and memory-intensive algorithms without external memory dependence.
• Extensive I/O: 920 I/O pins enable high channel counts and flexible interfacing to peripherals and external devices.
• Compact, assembly-ready package: 1932-BBGA FCBGA footprint (45 × 45 mm) supports dense PCB layouts while remaining compatible with surface-mount assembly processes.
• Commercial temperature range: Rated for 0 °C to 85 °C operation to meet standard commercial deployment conditions.
• Manufacturer pedigree: Supplied by Intel, providing consistency in device identification and procurement.

Why Choose EP4SGX530NF45C3?

The EP4SGX530NF45C3 combines a large logic capacity, substantial embedded memory, and a high I/O count in a single FCBGA package, making it a practical choice for designs that require integration of multiple high-density digital functions. Its defined supply voltage range and commercial operating temperature make it suitable for enterprise and commercial applications where predictable electrical and thermal characteristics are required.

This device is appropriate for engineering teams and procurement organizations looking for a high-capacity Stratix IV GX FPGA from a recognized manufacturer, enabling consolidation of system functions and potential BOM reduction through high integration.

Request a quote today to check availability and pricing for EP4SGX530NF45C3 or submit your specification needs to receive a tailored procurement response.