EP4SGX530NF45C4
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 28033024 531200 1932-BBGA, FCBGA |
|---|---|
| Quantity | 313 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 920 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530NF45C4 – Stratix® IV GX Field Programmable Gate Array (FPGA, 531,200 logic elements, 920 I/Os)
The EP4SGX530NF45C4 is a Stratix IV GX series Field Programmable Gate Array (FPGA) delivering large logic capacity and extensive I/O for high-bandwidth, high-complexity designs. The device combines a dense programmable fabric with substantial embedded memory and series-level high-speed transceiver and I/O features described in the Stratix IV device handbook.
Targeted at communications, high-performance signal-processing, and systems requiring wide external memory and protocol support, this commercial-grade FPGA provides designers with the logic, memory, and I/O resources needed to implement complex data-paths and system integration on a 1932-BBGA FCBGA package.
Key Features
- Core Capacity — 531,200 logic elements (logic element cells) for implementing large, complex digital designs and custom accelerators.
- Embedded Memory — Approximately 28 Mbits of on-chip RAM (28,033,024 total RAM bits) to support buffering, lookup tables, and local storage.
- High I/O Count — Up to 920 I/O pins to connect to external devices, memory, and high-speed interfaces.
- Series-Level Transceiver and Interface Features — Stratix IV GX device handbook describes high-speed transceiver capabilities and wide protocol support, enabling high aggregate data bandwidth and flexible external memory interfaces.
- Power and Voltage — Operates from a core supply range of 870 mV to 930 mV, allowing precise power management and integration with low-voltage system rails.
- Package and Mounting — 1932-BBGA (FCBGA) package, supplier device package noted as 1932-FBGA, FC (45×45); surface-mount mounting type for compact board integration.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature, suitable for commercial applications.
- RoHS Compliant — Device is RoHS compliant.
Typical Applications
- High-speed networking and communications — Use the Stratix IV GX family’s high-speed transceiver features and large logic fabric to implement packet processing, protocol bridging, and line-rate data-paths.
- DSP and signal processing — With substantial logic resources and approximately 28 Mbits of embedded memory, the device supports on-chip acceleration for filtering, encoding/decoding, and other DSP workloads.
- External memory interfaces — The device’s architecture and I/O count support complex external memory controllers and buffering schemes for storage and high-throughput applications.
- System integration and prototyping — High logic capacity and abundant I/O enable integration of multiple subsystems and rapid hardware prototyping for advanced digital designs.
Unique Advantages
- Large programmable fabric: 531,200 logic elements provide the headroom to implement complex state machines, datapaths, and custom accelerators without immediate partitioning.
- Significant on-chip memory: Approximately 28 Mbits of embedded RAM reduces dependence on external memory for mid-sized buffering and local storage needs.
- Extensive I/O resources: 920 I/Os enable broad connectivity to peripherals, memory devices, and multi-lane interfaces.
- High-density package: 1932-BBGA FCBGA package (45×45) supports dense routing and board-level integration while keeping the solution compact.
- Low-voltage core operation: Core supply range of 870–930 mV supports modern low-voltage power architectures and careful power budgeting.
- Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C and RoHS-compliant for standard commercial deployments.
Why Choose EP4SGX530NF45C4?
EP4SGX530NF45C4 positions itself as a high-capacity Stratix IV GX FPGA option for designers who need substantial logic resources, large embedded memory, and a high I/O count in a compact FCBGA package. Its combination of programmable fabric, memory, and series-level high-speed transceiver and interface features make it suitable for demanding communications, DSP, and system-integration tasks.
For teams building high-throughput data-paths, memory-rich controllers, or complex prototyping platforms, this device offers a balance of performance and integration that helps consolidate system functions and simplify board-level design decisions while operating within a commercial temperature range.
Request a quote or submit an inquiry to discuss availability, pricing, and lead times for EP4SGX530NF45C4. Our team can provide the procurement details you need to move your design forward.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018