EP4SGX530NF45I3

IC FPGA 920 I/O 1932FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 28033024 531200 1932-BBGA, FCBGA

Quantity 900 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O920Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530NF45I3 – Stratix® IV GX FPGA, 531,200 logic elements

The EP4SGX530NF45I3 is a Stratix IV GX field-programmable gate array from Intel, delivering a high-capacity FPGA fabric based on the Stratix IV GX device family. It combines a large logic resource set with embedded memory and advanced I/O capabilities to address bandwidth- and compute-intensive designs.

This industrial-grade, surface-mount device is targeted at applications that require extensive logic, dense I/O, and system-level integration, leveraging on-chip RAM, DSP capabilities, programmable clocking, and high-speed differential I/O features described for the Stratix IV family.

Key Features

  • Core Logic  531,200 logic elements provide substantial capacity for complex FPGA designs and large-scale integration.
  • Embedded Memory  Approximately 28 Mbits of on-chip RAM to support buffering, frame storage, and intermediate data processing.
  • I/O Density  920 I/O pins offer extensive external connectivity for parallel buses, memory interfaces, and multi-lane high-speed links.
  • Stratix IV GX Architecture  Device family features include dedicated DSP blocks, PLLs, and clock networks appropriate for signal processing and system timing (as described in the Stratix IV documentation).
  • High-Speed Transceiver Support  Stratix IV GX devices include high-speed differential I/O and transceiver feature sets for protocol support and high aggregate bandwidth (per the Stratix IV family handbook).
  • Power Supply  Core supply requirement of 870 mV to 930 mV for the device core.
  • Package and Mounting  1932-ball FCBGA (45 × 45 mm) surface-mount package for dense board-level integration.
  • Operating Range  Industrial operating temperature from −40 °C to 100 °C and RoHS compliance for regulatory conformity.

Typical Applications

  • High‑speed communications and networking  Use the device’s Stratix IV GX transceiver features and large I/O count for multi‑lane links, protocol bridging, and packet processing.
  • Digital signal processing and compute  Leverage abundant logic elements and approximately 28 Mbits of embedded memory for DSP pipelines, filtering, and real‑time data manipulation.
  • High‑performance instrumentation  Implement complex data acquisition, preprocessing, and control logic using the device’s extensive logic fabric and clocking resources.
  • System integration and custom silicon replacement  Consolidate multiple discrete functions into a single FPGA fabric to reduce board-level complexity using the device’s large logic and I/O resources.

Unique Advantages

  • High integration density: 531,200 logic elements and substantial on-chip RAM enable consolidation of complex subsystems into a single device.
  • Extensive external connectivity: 920 I/O pins support wide parallel interfaces and many high-speed lanes without external multiplexing.
  • Industrial temperature capability: −40 °C to 100 °C operating range supports deployment in temperature‑challenging environments.
  • Compact board footprint: 1932-ball FCBGA (45 × 45 mm) surface-mount package allows high-density PCB designs while maintaining package-level routing resources.
  • Power-conscious core: Defined core supply range of 870–930 mV facilitates low-voltage core designs and predictable power planning.
  • Standards-aligned family features: Stratix IV GX family features—such as DSP blocks, PLLs, clock networks, and high-speed I/O—provide documented building blocks for protocol support and signal processing.

Why Choose EP4SGX530NF45I3?

The EP4SGX530NF45I3 positions itself as a high-capacity Stratix IV GX FPGA that brings together large logic resources, significant embedded memory, and a very high I/O count in an industrial-grade, surface-mount package. Its documented Stratix IV family features—DSP resources, programmable clocking, and high-speed I/O—make it suitable for designs that demand compute density and system-level connectivity.

This device is appropriate for engineering teams designing networked systems, signal-processing appliances, and integrated platforms that require scalability and the documented capabilities of the Stratix IV GX architecture. Its combination of logic, memory, and I/O supports long-term design reuse and integration across complex hardware projects.

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