EP4SGX530NF45I3N

The EP4SGX530NF45I3N is an Intel Stratix IV GX field-programmable gate array delivering a large logic fabric and high I/O density in a 1932-ball FCBGA package. This industrial‑grade device combines hundreds of thousands of logic elements with substantial on‑chip memory to support complex, programmable digital systems.

With 531,200 logic elements, approximately 28 Mbits of embedded memory and 920 user I/O pins, the device is suited to designs that require extensive programmable logic, dense I/O connectivity and on‑chip memory resources. The part includes series features documented in the Stratix IV device handbook such as transceiver support, PLLs, DSP block resources and TriMatrix memory blocks.

Key Features

• Core Logic — 531,200 logic elements organized across 21,248 logic blocks, providing a large programmable fabric for complex logic and system integration.
• Embedded Memory — Approximately 28 Mbits of on‑chip RAM to support buffering, packet processing and on‑chip data storage requirements.
• I/O Density — 920 user I/O pins to support high‑density interfaces and multi‑lane connectivity in compact system layouts.
• Transceiver and System IP (Series Features) — Stratix IV device handbook headings indicate integrated transceiver datapath/PCS, PLLs, DSP blocks and TriMatrix memory block support for system‑level functions and timing control.
• Power and Operating Range — Core supply range of 870 mV to 930 mV and industrial operating temperature from −40 °C to 100 °C for dependable operation across a wide thermal window.
• Package and Mounting — 1932‑ball BGA (FCBGA), supplier device package 1932‑FBGA, FC (45×45), surface‑mount construction for high‑density PCB assembly.
• Compliance — RoHS compliant to support regulatory requirements for lead‑free designs.

Typical Applications

• High‑density Communication Systems — Use the 920 I/O and Stratix IV series transceiver capabilities to implement multi‑lane I/O, protocol bridging and packet processing functions.
• Signal Processing and Acceleration — Leverage the large logic element count and on‑chip memory for DSP pipelines, hardware accelerators and real‑time data processing blocks.
• Embedded System Integration — Combine extensive programmable logic and memory to consolidate multiple functions onto a single FPGA, reducing board complexity and BOM.
• Industrial Control and Monitoring — Industrial temperature rating and robust supply requirements make the device suitable for control systems that require sustained operation across wide temperature ranges.

Unique Advantages

• Large Programmable Fabric: 531,200 logic elements enable implementation of complex algorithms, multiple subsystems or high‑parallelism designs on a single device.
• Substantial On‑Chip Memory: Approximately 28 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage, simplifying system design.
• High I/O Count: 920 user I/Os support dense external interfaces and flexible pinout options for complex board layouts.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for use in thermally demanding or outdoor industrial environments.
• Compact, High‑Density Package: 1932‑ball FCBGA (45×45) enables high integration in space‑constrained assemblies while supporting surface‑mount manufacturing.
• Standards‑Oriented Series Features: The Stratix IV device family provides system‑level building blocks such as transceiver datapath/PCS, PLLs, DSP blocks and TriMatrix memory block support as referenced in the device handbook.

Why Choose EP4SGX530NF45I3N?

The EP4SGX530NF45I3N positions itself as a high‑capacity, industrial‑grade FPGA for engineers who need extensive programmable logic, plentiful on‑chip memory and broad I/O connectivity in a single package. Its supply voltage and temperature range, combined with the Stratix IV series system features, make it a practical choice for complex embedded systems and high‑performance processing tasks.

This device suits teams looking to consolidate multiple functions into a single programmable device, reduce external component count, and maintain operation across a wide temperature range while leveraging the Stratix IV device family capabilities documented in the device handbook.

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