EP4SGX530NF45I4N

The EP4SGX530NF45I4N is a Stratix® IV GX Field Programmable Gate Array (FPGA) from Intel. It delivers a high-density programmable fabric with abundant I/O and on‑chip memory for demanding, bandwidth‑oriented designs.

Built on the Stratix IV GX architecture, this device integrates high‑speed transceiver features, embedded memory and DSP resources, and support for external memory interfaces and wide protocol coverage as described in the Stratix IV device handbook. Typical use cases include high‑bandwidth communications, realtime signal processing, and complex system integration where logic density and I/O capacity are essential.

Key Features

• Core / Fabric  Stratix IV GX architecture with 531,200 logic elements for large, complex programmable designs.
• Embedded Memory  Approximately 28 Mbits of on‑chip RAM (28,033,024 total RAM bits) to support buffering, FIFOs and local storage.
• I/O and Transceivers  920 I/O pins coupled with high‑speed transceiver features and support for a wide range of protocols and highest aggregate data bandwidth (as noted in the device handbook).
• DSP and Timing  Integrated digital signal processing blocks plus rich clock networks and PLLs referenced in the Stratix IV device documentation for advanced timing and data processing.
• Package & Mounting  1932‑BBGA FCBGA package (supplier package: 1932‑FBGA, FC 45×45) in a surface‑mount configuration for high pin‑count, compact board designs.
• Power  Core voltage supply range 870 mV to 930 mV for the device core.
• Thermal & Grade  Industrial grade with operating temperature range −40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑bandwidth communications  Leverages high‑speed transceiver features and wide protocol support for network infrastructure and telecom equipment.
• Real‑time signal processing  Large logic capacity and DSP resources enable complex filtering, FFTs and data reduction in instrumentation and processing nodes.
• Video and imaging pipelines  High aggregate data bandwidth and on‑chip memory support frame buffering, video preprocessing and high‑throughput interfaces.
• Test & measurement systems  Flexible programmable fabric and abundant I/O make the device suitable for custom data‑acquisition and measurement front‑ends.

Unique Advantages

• High logic density: 531,200 logic elements enable integration of complex subsystems within a single FPGA, reducing BOM and board complexity.
• Substantial on‑chip memory: Approximately 28 Mbits of embedded RAM supports buffering and local data storage for high‑throughput designs.
• Extensive I/O capacity: 920 I/O pins provide broad connectivity options for parallel interfaces, memory buses and peripheral signalling.
• Designed for bandwidth: Stratix IV GX transceiver features and architecture provide the foundation for high aggregate data throughput and multi‑protocol support.
• Industrial temperature range: −40 °C to 100 °C operating range supports deployment in demanding environments.
• Compact, high‑pin package: 1932‑BBGA (45×45) FCBGA package concentrates large I/O and logic capability in a manufacturable surface‑mount form factor.

Why Choose EP4SGX530NF45I4N?

The EP4SGX530NF45I4N positions itself as a high‑performance, highly integrated FPGA option within the Stratix IV GX family from Intel, offering the combination of large logic capacity, substantial embedded memory, and extensive I/O for bandwidth‑intensive applications. Its industrial temperature rating and RoHS compliance support deployment in commercial and industrial systems that require robustness and environmental compliance.

This device is suited to engineers and system architects building advanced communications, signal processing or imaging solutions who need a programmable platform with significant on‑chip resources and I/O density. Documentation and device handbook references for the Stratix IV family provide design guidance and architectural details to support evaluation and integration.

Request a quote or submit an inquiry for pricing and availability of EP4SGX530NF45I4N to discuss your design requirements and lead‑time options.