EP4SGX70DF29C2XN

The EP4SGX70DF29C2XN is a Stratix® IV GX Field Programmable Gate Array (FPGA) packaged in a 780-ball FCBGA (29×29) format for surface-mount board assembly. It delivers a high logic capacity and substantial on-chip RAM for designs that require dense programmable logic and extensive I/O connectivity within a commercial temperature range.

This device is suited to applications that demand significant programmable resources—providing 72,600 logic elements, approximately 7.56 Mbits of embedded memory, and 372 general-purpose I/Os—while operating from a single-core supply in the 0.870–0.930 V range.

Key Features

• Core Logic Density  Provides 72,600 logic elements to implement complex combinational and sequential logic functions on a single device.
• Embedded Memory  Approximately 7.56 Mbits of on-chip RAM to support buffering, lookup tables, and local storage without external memory.
• I/O Capacity  372 I/O pins to accommodate wide parallel interfaces, multiple peripherals, and board-level connectivity requirements.
• Package and Mounting  Offered in a 780-FBGA (29×29) / 780-BBGA FCBGA package suitable for surface-mount PCB assembly where high pin-count, compact footprint, and thermal considerations are required.
• Power  Core supply operating range of 0.870 V to 0.930 V to match power delivery designs targeted at this family.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C ambient operation.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• Custom digital systems  Implement high-density custom logic and control algorithms using 72,600 logic elements and extensive I/O connectivity.
• Embedded memory–intensive functions  Use approximately 7.56 Mbits of on-chip RAM for buffering, LUTs, and local data storage to reduce external memory needs.
• Board-level high-pin-count designs  Leverage 372 I/Os and the 780-FBGA (29×29) package for compact, multi-interface boards requiring numerous signal connections.
• Commercial temperature deployments  Designed for applications and systems that operate in standard commercial environments (0 °C to 85 °C).

Unique Advantages

• High logic capacity: 72,600 logic elements allow consolidation of large designs onto one FPGA, reducing component count and board complexity.
• Significant on-chip RAM: Approximately 7.56 Mbits of embedded memory enables substantial local storage and buffering, simplifying external memory requirements.
• Extensive I/O availability: 372 I/Os support broad peripheral and bus interfacing without additional I/O expanders.
• Compact high-pin-count package: The 780-FBGA (29×29) package provides dense pinout in a surface-mount form factor suitable for compact PCB layouts.
• Controlled power envelope: Core operation between 0.870 V and 0.930 V facilitates power-supply planning for FPGA-centric designs.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose EP4SGX70DF29C2XN?

The EP4SGX70DF29C2XN positions itself as a high-capacity Stratix® IV GX FPGA option for designers needing substantial programmable logic, embedded memory, and I/O resources in a single commercial-grade package. Its combination of 72,600 logic elements, approximately 7.56 Mbits of on-chip RAM, and 372 I/Os makes it suitable for consolidating complex digital functions and reducing overall system BOM.

Choose this device when your design priorities include dense logic integration, significant on-chip storage, and a high pin-count package in a surface-mount format. The device’s defined supply and temperature ranges allow clear system-level power and thermal planning for commercial deployments.

Request a quote or submit an inquiry for EP4SGX70DF29C2XN to receive pricing, availability, and lead-time information tailored to your project requirements.