EP4SGX70DF29C3N

The EP4SGX70DF29C3N is a Stratix IV GX family FPGA in a 780-BBGA (29×29) surface-mount package. It delivers a high-density programmable fabric with 72,600 logic elements and approximately 7.56 Mbits of embedded memory, along with 372 user I/O pins for complex system integration.

Documented in the Stratix IV device handbook, the family includes high-speed transceiver and advanced I/O capabilities, clocking and PLL resources, and DSP-oriented logic — making this device suited to high-throughput logic, signal processing, and I/O‑dense applications within commercial temperature ranges.

Key Features

• Logic Capacity — 72,600 logic elements to implement complex custom logic, control functions, and parallel datapaths.
• Embedded Memory — Approximately 7.56 Mbits of on-chip RAM for buffering, FIFOs, and on-device data storage.
• I/O Density — 372 user I/Os to support wide external connectivity and multi-channel interfaces.
• Package & Mounting — 780-FBGA (29×29) FCBGA package, surface-mount mounting for compact board-level integration.
• Power — Core supply range specified at 870 mV to 930 mV to match system power rails and enable low-voltage operation.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature suitable for commercial electronics.
• Family-Level Architecture — Stratix IV device handbook describes features such as high-speed transceivers, DSP blocks, PLLs, clock networks, and advanced I/O techniques for protocol support and signal integrity.
• Regulatory — RoHS compliant.

Typical Applications

• High‑performance networking — Implement packet processing, protocol bridging, and multi-channel interfaces that leverage dense logic and high I/O counts.
• Digital signal processing — Use embedded memory and DSP-oriented fabric for filters, codecs, and real‑time data manipulation.
• System integration and prototyping — Consolidate multiple functions into a single FPGA for board-level integration and rapid design iteration.

Unique Advantages

• Highly integrated logic and memory: 72,600 logic elements combined with ~7.56 Mbits of embedded RAM reduce the need for external resources.
• High I/O count: 372 I/Os enable direct interfacing to multiple peripherals, memory buses, and high-channel-count systems.
• Compact BGA package: 780-FBGA (29×29) provides dense pinout and space-efficient board integration.
• Low-voltage core: Specified core supply of 0.87–0.93 V supports modern low-voltage power architectures.
• Designed for throughput: Stratix IV family-level features such as high-speed transceivers, clock networks, and PLLs support high aggregate data bandwidth and protocol flexibility.
• Commercial readiness: Commercial temperature rating and RoHS compliance make the device appropriate for a wide range of commercial electronic products.

Why Choose EP4SGX70DF29C3N?

EP4SGX70DF29C3N positions itself as a performance-focused, integration-friendly FPGA for designs that require substantial logic capacity, generous on-chip memory, and a high number of I/Os in a compact BGA package. Its documented Stratix IV family features support high-throughput interfaces and DSP-oriented workloads while operating within standard commercial temperature and power envelopes.

This device is well suited to engineering teams building I/O-dense, compute-intensive systems who need a reliable, well-documented FPGA platform with strong on‑device resources and compact board-level footprint.

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