EP4SGX70DF29I3

IC FPGA 372 I/O 780FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 7564880 72600 780-BBGA, FCBGA

Quantity 735 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2904Number of Logic Elements/Cells72600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7564880

Overview of EP4SGX70DF29I3 – Stratix® IV GX FPGA, 72,600 logic elements, 372 I/Os, Industrial FCBGA

The EP4SGX70DF29I3 is an Intel Stratix IV GX field-programmable gate array delivered in a 780-ball FCBGA package. It combines high logic density with substantial on-chip memory and a broad I/O complement to address demanding industrial and communications-oriented designs.

Designed for applications that require abundant programmable logic, embedded memory, and wide I/O bandwidth, this device pairs 72,600 logic elements and approximately 7.56 Mbits of embedded memory with 372 I/Os and an industrial operating temperature range for reliable operation across -40 °C to 100 °C.

Key Features

  • Logic Density — 72,600 logic elements provide a large fabric for implementing complex functions, custom accelerators, and system integration on a single device.
  • Embedded Memory — Approximately 7.56 Mbits of on-chip RAM to support buffering, packet processing, and data-path storage without external memory for many use cases.
  • I/O Capability — 372 general I/Os to support extensive peripheral interfacing, multi-channel data acquisition, and board-level connectivity.
  • Package and Mounting — 780-BBGA FCBGA (29 × 29) supplier device package in a surface-mount form factor for high-density PCB designs.
  • Industrial Temperature Range — Specified for operation from -40 °C to 100 °C to meet industrial application thermal requirements.
  • Core Supply Range — Voltage supply specified from 870 mV to 930 mV for the device core.
  • On‑chip System Resources — Device family documentation includes specifications for PLLs, DSP block functionality, TriMatrix memory blocks, transceiver performance, and detailed clock-tree and switching characteristics, enabling integrated timing and signal-processing designs.
  • Standards and Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

  • Industrial Automation and Control — Large logic capacity and industrial temperature rating enable complex control algorithms, motor drives, and factory-automation interfaces.
  • Communications Infrastructure — On-chip transceiver and high I/O count support protocol processing, packet handling, and line-rate interfacing in network equipment.
  • High‑Performance Signal Processing — Substantial logic resources and embedded RAM suit DSP pipelines, data acquisition systems, and real‑time processing tasks.
  • Test & Measurement — Flexible I/O and dense logic allow custom measurement front-ends, data aggregation, and instrument control implementations.

Unique Advantages

  • High integration of logic and memory: 72,600 logic elements paired with approximately 7.56 Mbits of embedded RAM reduce the need for external components and simplify board-level design.
  • Extensive I/O support: 372 I/Os provide the flexibility to interface multiple peripherals, ADC/DAC channels, and high-channel-count front ends without complex multiplexing.
  • Industrial-ready thermal range: Operation from -40 °C to 100 °C supports deployment in industrial environments and harsh conditions.
  • Comprehensive on-chip resources: Family-level specifications for PLLs, DSP blocks, TriMatrix memory, and transceivers enable designers to implement timing, signal processing, and high-speed I/O functions within the device.
  • Dense FCBGA package: 780-ball FCBGA (29 × 29) offers a compact footprint for high-density system designs where board space is at a premium.
  • Regulatory readiness: RoHS compliance supports lead-free manufacturing and environmental regulatory requirements.

Why Choose EP4SGX70DF29I3?

The EP4SGX70DF29I3 positions itself as a high-capacity Stratix IV GX FPGA option for engineers who need a combination of large programmable logic, abundant embedded memory, and extensive I/O in an industrial-grade package. Its documented family features—covering transceivers, PLLs, DSP and memory blocks, and detailed electrical and switching characteristics—help teams design deterministic, high-performance systems with on-chip resources.

This device is well suited to development teams building industrial controls, communications equipment, and advanced signal-processing systems that require long-term robustness, scalability within the Stratix IV device family, and clear device-level specifications for integration and verification.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the EP4SGX70DF29I3.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up