EP4SGX70DF29I3
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 7564880 72600 780-BBGA, FCBGA |
|---|---|
| Quantity | 735 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2904 | Number of Logic Elements/Cells | 72600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7564880 |
Overview of EP4SGX70DF29I3 – Stratix® IV GX FPGA, 72,600 logic elements, 372 I/Os, Industrial FCBGA
The EP4SGX70DF29I3 is an Intel Stratix IV GX field-programmable gate array delivered in a 780-ball FCBGA package. It combines high logic density with substantial on-chip memory and a broad I/O complement to address demanding industrial and communications-oriented designs.
Designed for applications that require abundant programmable logic, embedded memory, and wide I/O bandwidth, this device pairs 72,600 logic elements and approximately 7.56 Mbits of embedded memory with 372 I/Os and an industrial operating temperature range for reliable operation across -40 °C to 100 °C.
Key Features
- Logic Density — 72,600 logic elements provide a large fabric for implementing complex functions, custom accelerators, and system integration on a single device.
- Embedded Memory — Approximately 7.56 Mbits of on-chip RAM to support buffering, packet processing, and data-path storage without external memory for many use cases.
- I/O Capability — 372 general I/Os to support extensive peripheral interfacing, multi-channel data acquisition, and board-level connectivity.
- Package and Mounting — 780-BBGA FCBGA (29 × 29) supplier device package in a surface-mount form factor for high-density PCB designs.
- Industrial Temperature Range — Specified for operation from -40 °C to 100 °C to meet industrial application thermal requirements.
- Core Supply Range — Voltage supply specified from 870 mV to 930 mV for the device core.
- On‑chip System Resources — Device family documentation includes specifications for PLLs, DSP block functionality, TriMatrix memory blocks, transceiver performance, and detailed clock-tree and switching characteristics, enabling integrated timing and signal-processing designs.
- Standards and Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.
Typical Applications
- Industrial Automation and Control — Large logic capacity and industrial temperature rating enable complex control algorithms, motor drives, and factory-automation interfaces.
- Communications Infrastructure — On-chip transceiver and high I/O count support protocol processing, packet handling, and line-rate interfacing in network equipment.
- High‑Performance Signal Processing — Substantial logic resources and embedded RAM suit DSP pipelines, data acquisition systems, and real‑time processing tasks.
- Test & Measurement — Flexible I/O and dense logic allow custom measurement front-ends, data aggregation, and instrument control implementations.
Unique Advantages
- High integration of logic and memory: 72,600 logic elements paired with approximately 7.56 Mbits of embedded RAM reduce the need for external components and simplify board-level design.
- Extensive I/O support: 372 I/Os provide the flexibility to interface multiple peripherals, ADC/DAC channels, and high-channel-count front ends without complex multiplexing.
- Industrial-ready thermal range: Operation from -40 °C to 100 °C supports deployment in industrial environments and harsh conditions.
- Comprehensive on-chip resources: Family-level specifications for PLLs, DSP blocks, TriMatrix memory, and transceivers enable designers to implement timing, signal processing, and high-speed I/O functions within the device.
- Dense FCBGA package: 780-ball FCBGA (29 × 29) offers a compact footprint for high-density system designs where board space is at a premium.
- Regulatory readiness: RoHS compliance supports lead-free manufacturing and environmental regulatory requirements.
Why Choose EP4SGX70DF29I3?
The EP4SGX70DF29I3 positions itself as a high-capacity Stratix IV GX FPGA option for engineers who need a combination of large programmable logic, abundant embedded memory, and extensive I/O in an industrial-grade package. Its documented family features—covering transceivers, PLLs, DSP and memory blocks, and detailed electrical and switching characteristics—help teams design deterministic, high-performance systems with on-chip resources.
This device is well suited to development teams building industrial controls, communications equipment, and advanced signal-processing systems that require long-term robustness, scalability within the Stratix IV device family, and clear device-level specifications for integration and verification.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the EP4SGX70DF29I3.

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