EP4SGX70DF29C4

IC FPGA 372 I/O 780FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 7564880 72600 780-BBGA, FCBGA

Quantity 157 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2904Number of Logic Elements/Cells72600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7564880

Overview of EP4SGX70DF29C4 – Stratix IV GX FPGA, 780‑FBGA (29×29)

The EP4SGX70DF29C4 is a Stratix® IV GX field programmable gate array (FPGA) device designed for commercial-grade applications. It provides substantial logic capacity and embedded memory to support complex programmable logic and system integration.

With a high I/O count, a compact 780‑FBGA (29×29) surface-mount package, and a low-voltage supply range, this device is tailored for designs that require dense logic, significant on-chip RAM, and flexible interfacing within a commercial temperature envelope.

Key Features

  • Core Architecture Stratix IV GX field programmable gate array (FPGA) architecture supporting large-scale logic integration.
  • Logic Capacity Approximately 72,600 logic elements for implementing complex combinational and sequential logic functions.
  • Embedded Memory Approximately 7.56 Mbits of on-chip RAM (7,564,880 total RAM bits) to support buffering, FIFOs, and embedded data storage.
  • I/O Resources 372 general-purpose I/O pins to enable broad system connectivity and peripheral interfacing.
  • Power Specified operating supply voltage range from 870 mV to 930 mV to match low-voltage system designs.
  • Package and Mounting 780‑BBGA FCBGA package (supplier device package: 780‑FBGA, 29×29) with surface-mount mounting for compact board integration.
  • Operating Temperature & Grade Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant material composition.

Unique Advantages

  • High logic density: 72,600 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board area.
  • Substantial on-chip memory: Approximately 7.56 Mbits of embedded RAM supports data buffering and local storage without external memory.
  • Extensive I/O capability: 372 I/Os provide flexibility for interfacing to a wide range of peripherals and system buses.
  • Compact FCBGA package: The 780‑FBGA (29×29) surface‑mount package allows high-density PCB layouts while maintaining robust pin count.
  • Low-voltage operation: Narrow supply range (870 mV–930 mV) enables compatibility with low-voltage power domains and optimized power distribution.
  • Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial deployments.

Why Choose EP4SGX70DF29C4?

The EP4SGX70DF29C4 combines a high number of logic elements, substantial embedded memory, and a wide complement of I/Os in a compact 780‑FBGA package, making it a practical choice for commercial designs that require dense programmable logic and on-chip storage. Its low-voltage supply range and RoHS compliance further support contemporary board-level power and environmental requirements.

This FPGA is suitable for engineers and procurement teams seeking a configurable, high-capacity device for complex logic integration within a commercial temperature range, offering a balance of integration and system-level flexibility.

Request a quote or submit an inquiry to receive pricing and availability for EP4SGX70DF29C4.

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