EP4SGX70DF29C4
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 7564880 72600 780-BBGA, FCBGA |
|---|---|
| Quantity | 157 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2904 | Number of Logic Elements/Cells | 72600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7564880 |
Overview of EP4SGX70DF29C4 – Stratix IV GX FPGA, 780‑FBGA (29×29)
The EP4SGX70DF29C4 is a Stratix® IV GX field programmable gate array (FPGA) device designed for commercial-grade applications. It provides substantial logic capacity and embedded memory to support complex programmable logic and system integration.
With a high I/O count, a compact 780‑FBGA (29×29) surface-mount package, and a low-voltage supply range, this device is tailored for designs that require dense logic, significant on-chip RAM, and flexible interfacing within a commercial temperature envelope.
Key Features
- Core Architecture Stratix IV GX field programmable gate array (FPGA) architecture supporting large-scale logic integration.
- Logic Capacity Approximately 72,600 logic elements for implementing complex combinational and sequential logic functions.
- Embedded Memory Approximately 7.56 Mbits of on-chip RAM (7,564,880 total RAM bits) to support buffering, FIFOs, and embedded data storage.
- I/O Resources 372 general-purpose I/O pins to enable broad system connectivity and peripheral interfacing.
- Power Specified operating supply voltage range from 870 mV to 930 mV to match low-voltage system designs.
- Package and Mounting 780‑BBGA FCBGA package (supplier device package: 780‑FBGA, 29×29) with surface-mount mounting for compact board integration.
- Operating Temperature & Grade Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant material composition.
Unique Advantages
- High logic density: 72,600 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board area.
- Substantial on-chip memory: Approximately 7.56 Mbits of embedded RAM supports data buffering and local storage without external memory.
- Extensive I/O capability: 372 I/Os provide flexibility for interfacing to a wide range of peripherals and system buses.
- Compact FCBGA package: The 780‑FBGA (29×29) surface‑mount package allows high-density PCB layouts while maintaining robust pin count.
- Low-voltage operation: Narrow supply range (870 mV–930 mV) enables compatibility with low-voltage power domains and optimized power distribution.
- Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial deployments.
Why Choose EP4SGX70DF29C4?
The EP4SGX70DF29C4 combines a high number of logic elements, substantial embedded memory, and a wide complement of I/Os in a compact 780‑FBGA package, making it a practical choice for commercial designs that require dense programmable logic and on-chip storage. Its low-voltage supply range and RoHS compliance further support contemporary board-level power and environmental requirements.
This FPGA is suitable for engineers and procurement teams seeking a configurable, high-capacity device for complex logic integration within a commercial temperature range, offering a balance of integration and system-level flexibility.
Request a quote or submit an inquiry to receive pricing and availability for EP4SGX70DF29C4.

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