EP4SGX70DF29C3G

The EP4SGX70DF29C3G is a Stratix IV GX field-programmable gate array (FPGA) offered in a 780-ball FCBGA package. It delivers a dense programmable fabric with 72,600 logic elements and family-level features documented for the Stratix IV GX series, including on-chip memory and signal-processing resources.

This commercial-grade device targets high-performance embedded logic, system integration, and board-level designs that require substantial logic capacity, integrated embedded memory, and a large I/O count in a compact BGA footprint.

Key Features

• Programmable Fabric — 72,600 logic elements provide a high-density logic resource for complex custom logic, control, and acceleration functions.
• Embedded Memory — Approximately 7.56 Mbits of on-chip RAM suitable for buffering, FIFOs, and memory-mapped logic structures.
• I/O Capacity — 372 I/O pins support broad external interfacing and multi-channel connectivity from a single device.
• Stratix IV GX Family Features — Family documentation highlights architecture features such as DSP blocks, clock networks, and high-speed transceiver support relevant to high-throughput designs.
• Power Supply Range — Core supply range from 870 mV to 930 mV, enabling designs that target the specified supply envelope.
• Package — 780-ball FCBGA (supplier package listed as 780-FBGA, 29×29) provides a compact, board-ready footprint for high-density system designs.
• Commercial Operating Range — Rated for 0 °C to 85 °C operation and specified as commercial grade.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• High-performance signal processing — Use the device’s large logic capacity and on-chip memory for DSP pipelines, custom filters, and data aggregation.
• Networking and communications — Leverage family-level high-speed transceiver and I/O resources for packet processing, protocol bridging, and interface aggregation.
• Memory interface and buffering — Combine substantial embedded RAM with the logic fabric to implement memory controllers, buffering, and interface logic.
• Board-level system integration — Consolidate multiple glue-logic and control functions into one FPGA using the device’s high I/O count and dense logic.

Unique Advantages

• High logic density: 72,600 logic elements provide ample resources for complex designs and feature integration.
• Significant embedded memory: Approximately 7.56 Mbits of on-chip RAM reduces dependency on external RAM for many buffering and state storage needs.
• Extensive I/O: 372 I/O pins enable broad connectivity without adding external multiplexing logic.
• Compact BGA package: 780-ball FCBGA (29×29) delivers high pin count in a compact board footprint for space-constrained systems.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with standard commercial applications and environments.
• Standards-conscious supply: Core supply specified between 870 mV and 930 mV for predictable power-domain design.

Why Choose EP4SGX70DF29C3G?

EP4SGX70DF29C3G positions itself as a high-density Stratix IV GX FPGA option for designs that require substantial programmable logic, embedded memory, and broad I/O in a single, compact package. Its specification set supports integration of complex signal processing, interface logic, and system-level functions onto one device.

This part is well suited to engineers and system architects working on high-throughput board-level applications who need a commercially rated, RoHS-compliant FPGA with documented Stratix IV GX family capabilities and a high pin-count FCBGA package.

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