EP4SGX70DF29C4N

IC FPGA 372 I/O 780FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 7564880 72600 780-BBGA, FCBGA

Quantity 676 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2904Number of Logic Elements/Cells72600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7564880

Overview of EP4SGX70DF29C4N – Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 7564880 72600 780-BBGA, FCBGA

The EP4SGX70DF29C4N is a Stratix® IV GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 780-BBGA FCBGA package. It combines a large programmable logic fabric with substantial on-chip memory and high I/O density for complex digital designs.

Designed for commercial-grade applications, this surface-mount FPGA offers 72,600 logic elements, approximately 7.56 Mbits of embedded memory, and 372 I/O pins, with a supply voltage range of 870 mV to 930 mV and an operating temperature range of 0°C to 85°C.

Key Features

  • Logic Capacity  72,600 logic elements provide the programmable fabric needed for complex custom logic and control functions.
  • Embedded Memory  Approximately 7.56 Mbits of on-chip RAM for buffering, lookup tables, and state storage directly within the FPGA fabric.
  • I/O Resources  372 I/O pins to support extensive peripheral interfacing and multiple parallel and serial connections.
  • Package & Mounting  780-BBGA (780-FBGA supplier package, 29×29) in a surface-mount FCBGA footprint for compact board-level integration.
  • Power  Specified supply voltage range of 870 mV to 930 mV to meet low-voltage system requirements.
  • Temperature & Grade  Commercial grade operation from 0°C to 85°C for standard commercial and enterprise environments.
  • Environmental Compliance  RoHS compliant for adherence to common environmental standards.

Unique Advantages

  • High logic density: 72,600 logic elements enable integration of large custom logic blocks without multiple discrete devices.
  • Substantial on-chip memory: Approximately 7.56 Mbits of embedded RAM supports local data buffering and state retention, reducing external memory dependence.
  • Extensive I/O count: 372 I/Os accommodate high pin-count interfaces and multiple subsystems on a single FPGA.
  • Compact FCBGA package: 780-BBGA (29×29) surface-mount package enables a smaller PCB footprint for space-constrained designs.
  • Low-voltage operation: Rated for 870–930 mV supply, suitable for systems targeting low-voltage power rails.
  • Commercial-grade readiness: Specified 0°C to 85°C operating range and RoHS compliance make this device appropriate for standard commercial applications.

Why Choose EP4SGX70DF29C4N?

The EP4SGX70DF29C4N positions itself as a high-capacity Stratix® IV GX FPGA option for commercial designs that require large programmable logic, significant embedded memory, and high I/O density in a compact surface-mount package. Its 72,600 logic elements and approximately 7.56 Mbits of on-chip RAM allow consolidation of complex digital functions onto a single device.

This FPGA is suited for engineering teams and procurement seeking a RoHS-compliant, commercial-grade Stratix IV GX device with a 780-BBGA FCBGA footprint, a 372-pin I/O complement, and a low-voltage supply domain (870–930 mV). It delivers a balance of integration and board-level efficiency for a range of standard commercial applications.

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