EP4SGX70DF29I3N

The EP4SGX70DF29I3N is a Stratix IV GX field programmable gate array (FPGA) in a 780-FBGA (29×29) supplier package and a 780-BBGA (FCBGA) package case. It delivers large on-chip logic and memory resources alongside a high I/O count, targeting designs that require substantial programmable fabric, embedded memory, and high-speed interfacing.

Documented device-family features for Stratix IV GX devices include high-speed transceiver capabilities, advanced clocking and PLL resources, DSP blocks, and external memory interface support—making this device suitable for applications that demand significant bandwidth, protocol support, and on-chip processing capacity.

Key Features

• Core capacity — 72,600 logic elements and 2,904 logic blocks provide a large programmable fabric for complex logic integration and customization.
• Embedded memory — Approximately 7.56 Mbits of embedded memory (7,564,880 total RAM bits) for on-chip buffering, frame storage, or data staging.
• I/O and package — 372 user I/O pins in a 780-FBGA (29×29) supplier package; 780-BBGA (FCBGA) package case for high-density board integration.
• High-speed transceiver and bandwidth — Stratix IV GX family documentation highlights high-speed transceiver features and highest aggregate data bandwidth, enabling wide protocol and serial interface support.
• Signal integrity and timing — Device-family features include advanced clock networks and PLLs to support timing-critical designs and synchronized data paths.
• DSP and system integration — Family-level documentation identifies digital signal processing blocks and external memory interface support for integrated signal-processing and memory-intensive functions.
• Power — Supported core voltage supply range of 870 mV to 930 mV for the device core power domain.
• Industrial operating range — Rated for operation from −40 °C to 100 °C and designated as Industrial grade; RoHS compliant.

Typical Applications

• High-speed communications — Use the device’s high-speed transceiver features and high aggregate bandwidth to implement protocol bridging, packet processing, or serial link endpoints.
• Signal processing and DSP — Leverage the device-family DSP blocks and substantial embedded memory for real-time filtering, FFTs, or mixed-signal processing pipelines.
• External memory interfacing — Implement controllers and interface logic for external memory systems using the documented external memory interface features and on-chip resources.
• Industrial control and automation — Industrial-grade temperature range and extensive I/O make the device suitable for control, monitoring, and deterministic I/O aggregation in industrial environments.

Unique Advantages

• High logic density: 72,600 logic elements enable consolidation of complex functions into a single programmable device, reducing system-level component count.
• Substantial on-chip memory: Approximately 7.56 Mbits of embedded RAM supports local buffering and lowers dependence on external memory for many workloads.
• Extensive I/O capacity: 372 I/O pins provide flexible connectivity for parallel interfaces, control signals, and external peripherals.
• Family-level high-speed features: Stratix IV GX documentation emphasizes high-speed transceivers and aggregate bandwidth, supporting broad protocol and serial link requirements.
• Industrial robustness: Rated for −40 °C to 100 °C operation and listed as Industrial grade for deployments with extended temperature requirements.
• Standards-compliant supply and packaging: Core supply range of 870 mV–930 mV and available in a 780-FBGA (29×29) supplier package with a 780-BBGA (FCBGA) package case for compact, high-density board designs.

Why Choose EP4SGX70DF29I3N?

The EP4SGX70DF29I3N brings a combination of large logic capacity, significant embedded memory, extensive I/O, and documented high-speed transceiver and bandwidth features from the Stratix IV GX family. This configuration is well suited to designs that need consolidated programmable logic, on-chip RAM, and broad protocol or serial interface support within an industrial temperature envelope.

Engineers building communication infrastructure, signal-processing subsystems, memory-interface logic, or industrial control platforms will find the device’s resource mix and packaging options appropriate for board-level integration where density, on-chip resources, and deterministic I/O matter.

If you require pricing, availability, or a formal quote for the EP4SGX70DF29I3N, request a quote or submit an inquiry to receive detailed procurement information and assistance with your design requirements.