EP4SGX70DF29I4N

The EP4SGX70DF29I4N is an Intel Stratix IV GX field programmable gate array (FPGA) offered in a 780‑ball FCBGA package. It combines a high logic element count with embedded memory and the Stratix IV family architecture features to address high‑bandwidth, compute‑intensive designs.

Targeted at industrial applications, this device delivers substantial on‑chip resources, high‑speed I/O capabilities and operating range suitable for systems that require robust thermal and power tolerances.

Key Features

• Core architecture (Stratix IV GX): Family features from the Stratix IV device handbook include architecture optimizations for high aggregate data bandwidth and a wide range of protocol support.
• Logic capacity: 72,600 logic elements (cells) provide significant programmable logic for complex designs.
• Embedded memory: Approximately 7.56 Mbits of total on‑chip RAM to support buffering, packet handling and local data storage.
• I/O and transceivers: 372 I/O pins and Stratix IV GX high‑speed transceiver features as described in the device handbook for high‑speed differential I/O and protocol flexibility.
• DSP and timing resources: Family documentation lists dedicated DSP blocks, PLLs and extensive clocking networks to support signal processing and synchronous designs.
• Power supply: Core voltage supply range 0.87 V to 0.93 V for the programmable core.
• Package and mounting: 780‑BBGA FCBGA package (780‑FBGA, 29×29) in a surface‑mount format for compact board integration.
• Industrial operating range: Rated for −40 °C to 100 °C operation and RoHS compliant for regulated‑materials requirements.

Typical Applications

• High‑speed communications: Use the Stratix IV GX transceiver features and wide protocol support for serial links, protocol bridging and packet processing.
• Digital signal processing: Leverage on‑chip DSP resources and approximately 7.56 Mbits of embedded memory for filtering, modulation, and real‑time signal chains.
• Networking and data transport: High logic density and substantial embedded RAM enable switch, router and transport functions that require buffering and complex packet logic.
• Industrial control and automation: Industrial temperature rating and robust I/O count support demanding factory and process control applications.

Unique Advantages

• High logic density: 72,600 logic elements allow consolidation of multiple functions into a single FPGA, reducing bill‑of‑materials and board complexity.
• Significant embedded memory: Approximately 7.56 Mbits of on‑chip RAM enable local buffering and state storage without relying solely on external memory.
• Extensive I/O and high‑speed links: 372 I/O pins combined with Stratix IV GX transceiver features provide flexibility for mixed‑rate interfaces and protocol handling.
• Industrial temperature capability: Rated −40 °C to 100 °C to meet the thermal demands of rugged and industrial systems.
• Compact FCBGA package: 780‑ball (29×29) surface‑mount package supports dense PCB layouts while providing the pin count needed for complex systems.
• Documented family features: Backed by the Stratix IV device handbook, offering detailed architecture, timing and transceiver guidance for implementation.

Why Choose EP4SGX70DF29I4N?

The EP4SGX70DF29I4N positions itself as a high‑capacity Stratix IV GX FPGA for designs that require a combination of large programmable logic resources, substantial embedded memory and advanced I/O/transceiver capabilities. Its industrial temperature rating and compact 780‑ball FCBGA package make it suitable for systems that must balance performance with ruggedness and board density.

This device is appropriate for engineers building high‑bandwidth communications, DSP‑heavy, or industrial control systems that benefit from the Stratix IV family architecture and the supporting documentation provided in the device handbook.

Request a quote or submit a request for pricing and availability to evaluate the EP4SGX70DF29I4N for your next design.