EP4SGX70HF35C2G

The EP4SGX70HF35C2G is a Stratix IV GX field-programmable gate array from Intel offered in a 1152-BBGA FCBGA package. It integrates 72,600 logic elements and approximately 7.56 Mbits of embedded memory to support high-density programmable logic implementations.

With 488 I/O pins, a commercial operating range of 0 °C to 85 °C, and a core supply range of 870 mV to 930 mV, the device is suited for designs that require high logic capacity, significant on-chip memory, and substantial I/O connectivity within a compact surface-mount package.

Key Features

• Core Density — 72,600 logic elements for complex programmable logic and wide-design integration.
• Embedded Memory — Approximately 7.56 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Capacity — 488 I/O pins to accommodate multi-channel interfaces and high pin-count system designs.
• Package & Mounting — 1152-BBGA (1152-FBGA, 35×35) FCBGA package; surface-mount mounting type for board-level integration.
• Power Supply — Core voltage range of 870 mV to 930 mV, enabling compatibility with specific low-voltage system domains.
• Operating Temperature — Commercial grade operation from 0 °C to 85 °C for standard ambient environments.
• Standards & Compliance — RoHS-compliant device construction for environmentally conscious designs.
• Manufacturer — Intel (Stratix IV device family), with detailed device electrical and performance specifications available in the device handbook and datasheet.

Typical Applications

• High-density logic implementations — Use the device’s 72,600 logic elements to implement complex state machines, protocol stacks, and custom logic pipelines.
• On-chip memory intensive functions — Approximately 7.56 Mbits of embedded memory supports buffering, packet queues, and local data storage for real-time processing.
• High-I/O system integration — 488 I/O pins enable connection to multiple peripherals, multi-channel interfaces, and parallel I/O requirements on a single FPGA.

Unique Advantages

• High programmable capacity: 72,600 logic elements provide the density needed to consolidate multiple functions into a single FPGA, reducing system component count.
• Substantial embedded memory: Approximately 7.56 Mbits of on-chip RAM reduces the need for external memory in many buffering and data-path use cases.
• Large I/O footprint: 488 I/O pins support complex connectivity and multiple simultaneous interfaces without additional I/O expanders.
• Compact FCBGA package: 1152-BBGA (35×35) packaging offers a balance of pin density and board-level manufacturability for space-constrained designs.
• Low-voltage core operation: 870–930 mV supply range aligns with low-voltage core domains, supporting power-aware system architectures.
• Commercial grade and RoHS compliant: Designed for commercial temperature ranges and manufactured in RoHS-compliant processes for environmental compliance.

Why Choose EP4SGX70HF35C2G?

The EP4SGX70HF35C2G combines high logic density, significant embedded memory, and a large I/O count in a compact FCBGA package, making it suitable for system designs that consolidate multiple digital functions and require substantial on-chip resources. Its documented operating and electrical characteristics provide a clear specification foundation for engineering and procurement decisions.

This device is appropriate for customers building high-density programmable logic solutions who require documented device parameters (core voltage range, temperature limits, package details) and RoHS compliance. The Stratix IV device handbook and device datasheet supply additional electrical and switching characteristics to support integration and verification.

Request a quote or submit an RFQ to obtain pricing and availability for the EP4SGX70HF35C2G.