EP4SGX70HF35C2

The EP4SGX70HF35C2 is a Stratix® IV GX field‑programmable gate array (FPGA) in a 1152‑FBGA surface‑mount package, manufactured by Intel. It provides a high‑capacity programmable fabric with 72,600 logic elements and architecture features described in the Stratix IV device family documentation, including high‑speed transceiver and I/O capabilities.

Designed for designs that require large logic density, substantial embedded memory, and high I/O count, this device targets systems needing high aggregate data bandwidth and broad protocol support as documented for the Stratix IV GX family.

Key Features

• Logic Capacity — 72,600 logic elements for implementing complex logic, control and data‑path functions.
• Device Fabric — Stratix IV GX family architecture characteristics, including high‑speed transceiver features and the device handbook’s listed architecture elements.
• Embedded Memory — Approximately 7.56 Mbits of on‑chip RAM (7,564,880 bits) to support buffers, FIFOs and local data storage.
• DSP and Timing Resources — Family documentation identifies DSP blocks, PLLs and extensive clock networks for deterministic signal processing and timing control.
• I/O Density — 488 I/Os to support multiple external interfaces and parallel connections.
• Package and Mounting — 1152‑FBGA (35×35) FCBGA surface‑mount package for compact board integration.
• Power — Core voltage supply specified from 870 mV to 930 mV.
• Operating Range and Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High‑speed communications — Use where high aggregate data bandwidth and high‑speed transceiver features are required for protocol support and data transport.
• Signal processing and DSP — Implement intensive signal‑processing pipelines that leverage the family’s DSP blocks and embedded RAM for buffering and computation.
• Memory‑interfacing systems — Designs requiring external memory interfaces can benefit from the device’s on‑chip memory and I/O resources.
• System integration and prototyping — Large logic capacity and high I/O count make this device suitable for integrating multiple system functions into a single programmable device.

Unique Advantages

• High logic density: 72,600 logic elements enable consolidation of complex functions and multi‑block designs onto one FPGA.
• Substantial on‑chip RAM: Approximately 7.56 Mbits of embedded memory reduces dependence on external buffering for many applications.
• Extensive I/O: 488 I/Os support rich peripheral and parallel interface connectivity without immediate need for IO expanders.
• Family‑level transceiver and timing resources: Stratix IV GX documented transceiver, PLL and clock network features support high‑bandwidth and timing‑sensitive designs.
• Compact FCBGA package: 1152‑FBGA (35×35) allows high‑density board layouts while remaining surface‑mount compatible.
• Commercial temperature and RoHS compliance: Clear operating range (0 °C to 85 °C) and RoHS status simplify component selection for commercial applications.

Why Choose EP4SGX70HF35C2?

The EP4SGX70HF35C2 delivers a blend of large logic capacity, significant embedded memory and a high I/O count in a compact 1152‑FBGA package. Its Stratix IV GX family characteristics—documented high‑speed transceiver features, DSP resources and extensive clocking options—make it a suitable choice for developers building bandwidth‑intensive, protocol‑rich systems that require on‑device processing and integration.

This device is positioned for teams and projects that prioritize integration density and flexible, high‑performance programmable logic within commercial temperature environments. Its specifications support scalable designs that leverage the Stratix IV family architecture and resources.

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