EP4SGX70DF29C3

The EP4SGX70DF29C3 is a Stratix® IV GX field programmable gate array (FPGA) supplied in a 780-ball FCBGA package. It provides a high logic element count, abundant on-chip RAM, and a large I/O complement for commercial-grade programmable logic applications.

With 72,600 logic elements, approximately 7.56 Mbits of embedded memory and 372 I/Os, this device is suited to designs that require substantial programmable logic capacity and broad connectivity while operating within standard commercial temperature and voltage ranges.

Key Features

• Core Logic  72,600 logic elements provide significant programmable logic capacity for complex designs.
• Embedded Memory  Approximately 7.56 Mbits of on-chip RAM supports buffering, state storage, and data-path implementations without relying solely on external memory.
• I/O Density  372 user I/Os enable integration with multiple peripherals, high-pin-count interfaces, and dense board-level routing.
• Power  Core supply range of 870 mV to 930 mV supports integration with low-voltage system rails.
• Package & Mounting  780-ball BGA (780-FBGA, 29×29) package in a surface-mount format for compact, high-density PCB designs.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C to match standard electronic product environments.
• RoHS Compliance  RoHS-compliant manufacturing supports regulatory and supply-chain requirements.

Typical Applications

• High-density programmable logic systems  Use the extensive logic element count for complex control, processing, or glue-logic implementations.
• I/O-rich designs  Leverage 372 I/Os for multi-interface systems, board-level bridges, and peripheral aggregation.
• Memory-dependent data paths  Embedded RAM (≈7.56 Mbits) supports buffering and temporary storage within the FPGA fabric.
• Commercial electronic products  Designed for systems operating in the 0 °C to 85 °C range where commercial-grade components are required.

Unique Advantages

• Substantial logic capacity: 72,600 logic elements reduce the need for external programmable devices, simplifying BOM and board complexity.
• On-chip memory: Approximately 7.56 Mbits of embedded RAM enables local data buffering and state storage, improving data-path efficiency.
• High I/O count: 372 I/Os give designers flexibility to connect multiple interfaces and peripherals without additional I/O expansion.
• Compact, surface-mount package: The 780-ball FCBGA (29×29) package supports high-density PCB designs while maintaining robust electrical connections.
• Commercial temperature and RoHS compliance: Specified 0 °C to 85 °C operation and RoHS compliance align with many standard product requirements.
• Low-voltage core support: Core supply range of 870–930 mV enables integration with modern low-voltage system architectures.

Why Choose EP4SGX70DF29C3?

The EP4SGX70DF29C3 positions itself as a high-capacity Stratix® IV GX FPGA option for commercial designs that demand large programmable fabric, substantial embedded memory and a wide complement of I/Os. Its combination of logic density, on-chip RAM and 372 I/Os makes it well suited to system-level designs that consolidate functionality into a single FPGA solution.

For engineering teams and procurement focused on scalability and integration, this device offers a balance of programmable resources, package density and commercial-grade operating conditions that supports robust product development and deployment.

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