EP4SGX70DF29C2X

The EP4SGX70DF29C2X is a Stratix IV GX field-programmable gate array (FPGA) offered in a 780‑FBGA (29×29) surface-mount package. It delivers high logic density and extensive I/O capacity for commercial embedded designs that require significant on-chip resources.

Designed around the Stratix IV GX device family, documentation for the series includes detailed specifications for core performance, transceivers, DSP blocks, TriMatrix memory, PLLs and clocking. The part combines 72,600 logic elements with substantial embedded memory and a wide I/O complement to support complex system integration.

Key Features

• Logic Capacity – 72,600 logic elements for implementing high-density combinational and sequential logic.
• Embedded Memory – Approximately 7.56 Mbits of on-chip RAM, suitable for buffering, look-up tables, and intermediate data storage.
• I/O Resources – 372 I/O pins to support parallel interfaces, mixed signaling and dense connectivity requirements.
• Package and Mounting – 780‑FBGA (29×29) FCBGA package in a surface-mount form factor for compact board-level integration.
• Power Supply – Core voltage specified at 870 mV to 930 mV, enabling precise power budgeting and regulator selection.
• Operating Range – Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Standards Compliance – RoHS compliant.
• Series Documentation – Device handbook sections include transceiver performance, DSP block specifications, TriMatrix memory block specs, PLL and clock tree information, and power/switching characteristics.

Typical Applications

• High-density logic integration – Use the FPGA’s 72,600 logic elements to consolidate multiple functions and custom logic into a single device.
• Data buffering and memory-intensive processing – Approximately 7.56 Mbits of embedded memory supports intermediate data storage and local buffering needs.
• I/O‑heavy systems – With 372 I/Os, the device is suited for designs requiring multiple parallel interfaces, sensor arrays, or extensive external connectivity.
• Commercial embedded platforms – The commercial operating temperature and surface-mount 780‑FBGA package enable deployment in a broad range of commercial equipment and instrumentation.

Unique Advantages

• High logic density: 72,600 logic elements allow complex designs to be implemented without external glue logic, simplifying board-level design.
• Significant on-chip memory: Approximately 7.56 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O count: 372 I/Os provide flexibility to interface with multiple peripherals and parallel buses, minimizing external multiplexing.
• Compact, manufacturable package: The 780‑FBGA (29×29) surface-mount package supports high-density PCB layouts and standard assembly processes.
• Series-level technical documentation: The Stratix IV device handbook contains detailed specifications for transceivers, DSP blocks, PLLs, power, and timing to support design validation and system integration.

Why Choose EP4SGX70DF29C2X?

The EP4SGX70DF29C2X positions itself as a high-capacity Stratix IV GX FPGA option for commercial applications that need substantial logic, embedded memory, and broad I/O. Its combination of 72,600 logic elements, approximately 7.56 Mbits of on-chip RAM, and 372 I/Os enables integration of complex functions while reducing external component count.

This device is suited for designers and teams building commercial embedded systems requiring dense programmable logic, flexible interfacing and reliable vendor documentation. The part’s package, power range and documented series specifications provide a clear foundation for component selection and system-level planning.

Request a quote or submit an inquiry to discuss availability, pricing, and lead time for EP4SGX70DF29C2X. Our team can provide the purchasing information and technical support you need to move your design forward.