EP4SGX530KF43I4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 224 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 880 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530KF43I4G – Field Programmable Gate Array (FPGA) IC
The EP4SGX530KF43I4G is an Intel Stratix IV family FPGA optimized for high-density, high-throughput designs. It combines a large logic fabric with embedded memory and platform-level I/O resources to address demanding applications in communications, high-performance signal processing, and industrial systems.
Designed for industrial-grade operation, the device provides a substantial number of logic elements, extensive on-chip RAM, and a wide I/O count, enabling system designers to integrate complex functions and high-bandwidth interfaces within a single surface-mount FCBGA package.
Key Features
- Large logic capacity — 531,200 logic elements to implement complex digital functions and system-level integration.
- Embedded memory — approximately 28.03 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
- Extensive I/O — 880 I/O pins to support numerous external interfaces and high-pin-count system connections.
- High-speed fabric and transceiver support — Device handbook notes high-speed transceiver and differential I/O capabilities suitable for wide protocol and bandwidth requirements.
- Signal and clock infrastructure — Integrated clock networks and PLL resources described in the Stratix IV documentation to support synchronous, high-performance designs.
- DSP and system resources — Includes documented digital signal processing (DSP) block resources for compute-intensive signal processing tasks.
- Package and mounting — 1760-FCBGA (42.5 × 42.5 mm) surface-mount package for compact, board-level integration; package case listed as 1760-BBGA/FCBGA.
- Operating conditions — Industrial-grade device rated for operation from −40 °C to 100 °C and RoHS compliant.
- Core voltage range — Core supply specified at 870 mV to 930 mV for compatibility with targeted power rails.
Typical Applications
- Telecommunications and networking — Implement protocol handling, packet processing, and high-bandwidth interfaces using the device’s large logic capacity, high-speed transceiver features, and extensive I/O.
- High-performance signal processing — Leverage embedded DSP blocks and on-chip RAM for real-time filtering, FFTs, and other compute-intensive algorithms.
- Data acquisition and test equipment — Use abundant I/O and memory resources for multi-channel capture, buffering, and preprocessing before host transfer.
- Industrial control and automation — Industrial temperature rating and robust packaging support reliable operation in factory and process-control environments.
Unique Advantages
- High integration density: 531,200 logic elements reduce the need for external controllers and simplify system BOM by consolidating functionality on-chip.
- Substantial embedded memory: Approximately 28.03 Mbits of on-chip RAM provides local buffering and state storage for latency-sensitive tasks.
- High I/O count: 880 I/Os allow flexible interfacing to multiple peripherals, memory devices, and high-speed links without extensive board-level multiplexing.
- Industrial-grade reliability: Rated for −40 °C to 100 °C operation, making the device suitable for thermally demanding installations.
- Compact system integration: 1760-FCBGA package (42.5 × 42.5 mm) enables dense board-level implementation while maintaining signal routing capacity.
- Documented Stratix IV platform: Part of the Stratix IV device family with comprehensive device handbook material covering architecture, transceivers, clocking, and I/O features.
Why Choose EP4SGX530KF43I4G?
The EP4SGX530KF43I4G delivers a balance of large logic capacity, ample embedded memory, and a high I/O count in an industrial-grade Stratix IV FPGA. These characteristics make it well-suited for designs that require on-chip consolidation of complex logic, real-time signal processing, and high-bandwidth external interfaces.
For engineers building communication systems, test equipment, or industrial controllers, this device offers a documented platform and system-level resources that support scalable, reliable implementations while simplifying board-level integration and reducing external component count.
Request a quote or contact sales to discuss availability, pricing, and how EP4SGX530KF43I4G can fit your next design project.

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