EP4SGX530KF43I3N

IC FPGA 880 I/O 1760FCBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 28033024 531200 1760-BBGA, FCBGA

Quantity 431 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O880Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530KF43I3N – Stratix IV GX FPGA, 1760-FCBGA (Industrial)

The EP4SGX530KF43I3N is a Stratix IV GX field-programmable gate array (FPGA) offered in a 1760‑ball FCBGA package. It combines a very large logic fabric with substantial on-chip memory and a high I/O count for designs that require dense, high-throughput programmable logic.

Designed for industrial applications, the device targets use cases that leverage high-speed transceiver features, extensive external memory interfacing and DSP-oriented processing, while providing deterministic operating ranges and RoHS compliance.

Key Features

  • Core Logic — 531,200 logic elements (LEs) provide a large, programmable fabric for complex digital functions and custom hardware acceleration.
  • Configurable Logic Blocks — 21,248 CLBs (configurable logic blocks) for structured logic partitioning and design mapping.
  • Embedded Memory — Approximately 28 Mbits of on-chip RAM to support buffering, FIFOs and local data storage within designs.
  • I/O Resources — 880 user I/O pins to support dense external interfacing and board-level integration.
  • High‑Speed Transceiver Features — Includes Stratix IV GX high-speed transceiver features and architecture (see device handbook) for serial links and protocol support.
  • External Memory Interfaces — Device family documentation describes support for high-bandwidth external memory interfaces for system memory expansion.
  • Power Supply — Core voltage range from 870 mV to 930 mV, enabling low-voltage core operation and power-optimized designs.
  • Package & Mounting — 1760‑FCBGA (42.5 × 42.5 mm) surface-mount package for high-density PCB implementations.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial environments.
  • Compliance — RoHS compliant.

Typical Applications

  • High‑Speed Serial Communications — Implement protocol engines and serial link interfaces using the Stratix IV GX transceiver features together with the device's high logic capacity.
  • External Memory Controllers — Use the device's I/O density and documented external memory interface support to build high-bandwidth memory subsystems.
  • DSP & Signal Processing — Leverage large logic resources and on‑chip RAM for DSP pipelines, real-time filtering and custom acceleration blocks.
  • Network & Infrastructure Equipment — Support packet processing, traffic management and protocol handling tasks that require substantial logic, I/O and embedded memory.

Unique Advantages

  • Highly Scalable Logic Capacity: 531,200 logic elements enable large, complex designs and hardware acceleration within a single device.
  • Significant On‑Chip Memory: Approximately 28 Mbits of embedded RAM reduce external memory dependency for buffering and local data storage.
  • Extensive I/O Resources: 880 user I/Os accommodate wide external interfaces and multi‑lane connectivity without multiplexing compromises.
  • High‑Speed Serial Support: Stratix IV GX transceiver features and family documentation support high-bandwidth serial protocols for modern link designs.
  • Industrial Reliability: −40 °C to 100 °C operating range and RoHS compliance align with industrial deployment requirements.
  • Compact, High‑Density Package: 1760‑FCBGA (42.5 × 42.5 mm) package enables high logic density in space-constrained board designs.

Why Choose EP4SGX530KF43I3N?

The EP4SGX530KF43I3N delivers a combination of large programmable logic, substantial embedded memory and a very high I/O count in a single industrial-grade Stratix IV GX device. These characteristics make it suitable for designers building high-throughput, DSP‑intensive or memory‑interfacing systems that require deterministic operating ranges and a compact footprint.

As part of the Stratix IV device family, this FPGA is documented in the Stratix IV device handbook, providing guidance on architecture features such as transceivers, clocking and memory interfaces to help integrate the device into complex systems.

Request a quote or submit an inquiry to check pricing, availability and lead time for EP4SGX530KF43I3N. Our team can provide additional ordering information and support to evaluate the device for your project.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up