EP4SGX530KF43I3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 519 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 880 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530KF43I3G – Field Programmable Gate Array (FPGA) IC
The EP4SGX530KF43I3G is an Intel Stratix IV family FPGA device. It implements the Stratix IV architecture and GX-class features documented in the Stratix IV Device Handbook.
With 531,200 logic elements, approximately 28 Mbits of embedded memory, and 880 I/O, this surface-mount, industrial-grade FPGA targets high-density logic, memory, and I/O designs that require robust thermal range and scalable system integration.
Key Features
- Stratix IV architecture (GX features) Device is based on the Stratix IV family with GX-class capabilities as described in the Stratix IV Device Handbook, including high-speed transceiver and protocol support.
- Logic capacity 531,200 logic elements to implement large-scale FPGA designs and complex custom logic.
- Embedded memory Approximately 28 Mbits of on-chip RAM for buffering, lookup tables, and local storage.
- High I/O count 880 user I/O pins to support dense external connectivity and multiple peripheral interfaces.
- Package and mounting 1760-FCBGA (42.5×42.5 mm) package, surface-mount mounting type for high-density board integration.
- Power supply Core voltage range of 870 mV to 930 mV, enabling defined power planning for the FPGA core.
- Industrial temperature grade Rated for operation from −40 °C to 100 °C and designated industrial grade for demanding environments.
- Series-level system features Stratix IV family capabilities include embedded DSP blocks, flexible clock networks, PLLs, high-speed differential I/O, and external memory interface support as documented in the device handbook.
- Regulatory compliance RoHS compliant for environmental and manufacturing considerations.
Typical Applications
- High-speed communications Leverage Stratix IV GX transceiver features and 880 I/Os for protocol implementation, line-rate packet processing, and interface bridging.
- Signal processing and DSP Large logic capacity, embedded memory, and family-level DSP resources support FPGA-based filtering, transforms, and real-time processing pipelines.
- External memory controllers and interfaces Abundant I/O and documented external memory interface capabilities facilitate memory-controller implementations and high-bandwidth buffering.
- Industrial control and instrumentation Industrial-grade temperature range and robust packaging suit control systems, measurement equipment, and factory automation that require extended thermal tolerance.
Unique Advantages
- High integration density: 531,200 logic elements and substantial embedded memory let you consolidate complex functions into a single device.
- Extensive I/O availability: 880 I/O pins reduce the need for external multiplexing and simplify connectivity to peripherals and high-pin-count interfaces.
- Industrial-temperature operation: Rated from −40 °C to 100 °C and classified as industrial grade for deployment in temperature-challenging environments.
- Industry-documented architecture: Built on the Stratix IV family with documented features such as DSP blocks, PLLs, clock networks, and high-speed differential I/O in the Stratix IV Device Handbook.
- Compact, high-density package: 1760-FCBGA (42.5×42.5 mm) surface-mount package supports dense board designs while providing the footprint required for large FPGA resources.
- Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing and supply requirements.
Why Choose EP4SGX530KF43I3G?
The EP4SGX530KF43I3G combines large programmable logic capacity, substantial embedded memory, and a high I/O count within the Stratix IV family architecture to address demanding, I/O-heavy, and compute-intense FPGA applications. Its industrial temperature rating and surface-mount FCBGA packaging make it suitable for systems requiring robust operation and compact board integration.
This device is appropriate for engineering teams building high-throughput communications, advanced signal-processing, and industrial-control solutions that rely on the documented Stratix IV architecture and the resource set provided by this part.
Request a quote or submit a pricing inquiry to evaluate EP4SGX530KF43I3G for your next design and to obtain availability and ordering information.

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