EP4SGX530KF43C4N

The EP4SGX530KF43C4N is a Stratix IV GX field‑programmable gate array (FPGA) in a 1760‑FCBGA package from Intel. It integrates a large programmable fabric with high‑density logic, embedded memory, extensive I/O and on‑die features targeted at high‑bandwidth and protocol‑rich designs.

This device is suited for applications that require significant logic capacity, substantial on‑chip RAM, and advanced I/O/transceiver capabilities while operating within a commercial temperature range.

Key Features

• Logic Capacity — 531,200 logic elements provide high-density programmable logic for complex algorithms and control functions.
• Embedded Memory — Approximately 28 Mbits of on‑chip RAM to support buffering, packet processing, and local data storage.
• I/O Density — 880 user I/O pins for broad peripheral and interface connectivity.
• High‑Speed Transceivers and Differential I/O — Family documentation references high‑speed transceiver features and support for high‑speed differential I/O with DPA and Soft‑CDR for robust serial link designs.
• Digital Signal Processing (DSP) and Clocking — Device family includes DSP block resources and dedicated clock networks with PLLs to support synchronous, high‑performance signal processing architectures.
• External Memory Interfaces — Device family documentation indicates support for external memory interface implementations for expanded system memory.
• Package and Mounting — 1760‑BBGA (1760‑FCBGA) supplier package listed as 1760‑FCBGA (42.5×42.5), surface‑mount mounting type.
• Power and Supply — Core supply range specified as 870 mV to 930 mV.
• Commercial Grade and Temperature — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• High‑throughput serial links — Implement high‑bandwidth serial protocols using the device family’s high‑speed transceiver and differential I/O features.
• Signal processing and DSP — Deploy DSP blocks and extensive logic capacity for algorithm acceleration, filtering, and real‑time data processing.
• Memory interface controllers — Use on‑chip RAM combined with external memory interface support to build controllers and buffering subsystems.
• Protocol bridging and protocol engines — Leverage large logic and I/O count to implement protocol conversion, packet handling, and custom interface logic.

Unique Advantages

• High logic density: 531,200 logic elements enable complex custom logic and large FPGA designs without immediate partitioning to multiple devices.
• Substantial embedded memory: Approximately 28 Mbits of on‑chip RAM reduces dependency on external buffering for many applications.
• Extensive I/O count: 880 I/O pins allow flexible system interfacing and support for multiple peripherals or parallel buses.
• Advanced I/O and transceiver capability: Family features include high‑speed transceivers and differential I/O methods (DPA, Soft‑CDR) suited for demanding serial link designs.
• Commercial temperature suitability: Rated 0 °C to 85 °C for deployment in commercial‑grade environments.
• Compact, surface‑mount package: 1760‑FCBGA (42.5×42.5) package provides a high‑pin‑count solution in a compact footprint for dense PCB designs.

Why Choose EP4SGX530KF43C4N?

The EP4SGX530KF43C4N combines a high density of logic elements, significant embedded memory, and a large I/O complement in a single commercial‑grade Stratix IV GX device. Its documented family features—high‑speed transceivers, DSP resources, dedicated clocking and PLLs—support designs that require substantial bandwidth, complex signal processing and robust serial interfaces.

This device is well suited to engineering teams implementing high‑performance FPGA designs that need on‑chip memory, extensive I/O, and advanced transceiver/I/O capabilities while maintaining a compact surface‑mount package and commercial temperature operation.

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