EP4SGX530KF43C2N

IC FPGA 880 I/O 1760FCBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 28033024 531200 1760-BBGA, FCBGA

Quantity 793 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O880Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530KF43C2N – Stratix® IV GX FPGA, 531,200 Logic Elements

The EP4SGX530KF43C2N is a Stratix IV GX field-programmable gate array (FPGA) IC offering a high-density programmable fabric and advanced I/O capabilities. Built on the Stratix IV device family architecture, this device targets applications that require large logic capacity, substantial on-chip memory, and high-speed I/O.

With 531,200 logic elements, approximately 28 Mbits of embedded memory, and 880 I/O pins in a 1760-FCBGA package, the device delivers integration and bandwidth suitable for demanding communications, video and compute-acceleration designs while operating within commercial temperature and voltage ranges.

Key Features

  • Core Capacity  531,200 logic elements and 21,248 LABs/CLBs provide substantial programmable fabric for complex logic, control and custom datapath implementations.
  • Embedded Memory  Approximately 28 Mbits of on-chip RAM to support large buffering, frame storage or intermediate data in DSP and packet-processing pipelines.
  • I/O Density & Flexibility  880 I/O pins support extensive external device interfacing and high aggregate I/O bandwidth for multi-channel systems.
  • High-Speed Transceiver & Protocol Support  Stratix IV GX family features high-speed transceiver and protocol support capabilities as described in the device handbook, enabling wide-ranging high-bandwidth interfaces.
  • DSP and System Features  Architecture includes DSP block resources and rich clock/PLL networks for implementing real-time signal processing and synchronous multi-domain systems.
  • Power and Operating Range  Core supply voltage range of 870 mV to 930 mV and commercial operating temperature from 0 °C to 85 °C.
  • Package & Mounting  Surface-mount 1760-FCBGA package (42.5 × 42.5 mm) for compact board-level integration.
  • Compliance  RoHS compliant.

Typical Applications

  • High-Speed Networking & Communications  Use the Stratix IV GX device for protocol handling, packet processing and aggregation where wide protocol support and high aggregate data bandwidth are required.
  • Video and Imaging Systems  Leverage the large logic capacity and approximately 28 Mbits of embedded memory for multi-channel video processing, frame buffering and format conversion.
  • Compute Acceleration & DSP  Implement custom hardware accelerators and signal-processing pipelines using the device’s DSP resources and extensive logic fabric.
  • Test, Measurement & Instrumentation  Employ high I/O count and flexible clocking resources to build multi-channel acquisition, processing and analysis systems.

Unique Advantages

  • High Logic Density: 531,200 logic elements enable large-scale integration of control, datapath and interface logic on a single device, reducing external component count.
  • Significant On-Chip Memory: Approximately 28 Mbits of embedded RAM simplifies buffering and stateful processing without immediate dependence on external memory.
  • Extensive I/O Capability: 880 I/Os support complex multi-device interfaces and high channel counts for system expansion and modular designs.
  • Advanced I/O and Transceiver Features: Stratix IV GX device family includes high-speed transceiver and protocol support suitable for high-bandwidth system requirements.
  • Compact FCBGA Package: 1760-FCBGA (42.5 × 42.5 mm) enables dense board integration while maintaining robust thermal and signal routing options.
  • Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployment.

Why Choose EP4SGX530KF43C2N?

The EP4SGX530KF43C2N combines a high-capacity Stratix IV GX programmable fabric with substantial on-chip memory and a large I/O complement to address demanding designs that require integrated logic, memory and high-speed interfaces. Its architecture and documented device features support implementations across communications, video processing, compute acceleration and instrumentation.

This device is suited to engineering teams seeking a commercially graded FPGA with proven Stratix IV family capabilities, offering scalability in logic and memory resources while enabling complex protocol and high-bandwidth interface implementations.

Request a quote or submit an inquiry to receive pricing and availability for the EP4SGX530KF43C2N.

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