EP4SGX360KF40I3N

The EP4SGX360KF40I3N is a Field Programmable Gate Array (FPGA) device from Intel, designed for high-density digital integration. It offers 353,600 logic elements and approximately 23.1 Mbits of embedded memory to support complex, memory-intensive designs with large I/O counts.

Built in a 1517-BBGA (1517-FBGA, 40×40) package with surface-mount mounting and an industrial-grade temperature rating, this FPGA is suited to applications that require large logic capacity, extensive I/O, and a defined supply voltage range.

Key Features

• Logic Capacity — 353,600 logic elements to implement large-scale digital designs and complex custom logic.
• Embedded Memory — Approximately 23.1 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive functions.
• I/O Density — 744 user I/O pins to support wide parallel interfaces and multi-channel connectivity.
• Power Supply — Specified core voltage range of 870 mV to 930 mV to match system power-rail requirements.
• Package and Mounting — 1517-BBGA (Supplier: 1517-FBGA, 40×40) surface-mount package for compact board-level integration.
• Industrial Temperature Range — Operating temperature from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant — Meets RoHS requirements for hazardous substance restrictions.

Typical Applications

• High-density digital systems — Use the large logic capacity and embedded memory to implement complex custom digital engines and accelerators.
• Multi-channel I/O aggregation — Leverage 744 I/O pins to consolidate and manage multiple parallel interfaces on a single device.
• Memory-intensive logic — On-chip RAM enables buffering, lookup tables, and state machines without immediate need for external memory.

Unique Advantages

• Substantial logic resources: 353,600 logic elements provide headroom for large designs and feature-rich implementations.
• Significant on-chip RAM: Approximately 23.1 Mbits of embedded memory reduces dependency on external memory for many functions.
• High I/O count: 744 I/O pins simplify board-level routing for multi-channel or parallel-interface applications.
• Industrial-rated operation: Specified −40 °C to 100 °C operating range supports use in demanding environments.
• Compact BGA package: 1517-BBGA (1517-FBGA, 40×40) enables a dense board footprint while maintaining signal routing options.
• Manufacturer backing: Produced by Intel, providing alignment with established FPGA product lines.

Why Choose EP4SGX360KF40I3N?

The EP4SGX360KF40I3N positions itself as a high-capacity FPGA option for designs that require extensive logic resources, substantial embedded memory, and a large number of I/O signals. Its industrial temperature rating and defined supply voltage range make it suitable for robust, board-level integration where environmental range and power budgeting are important considerations.

This device is appropriate for engineering teams developing complex digital systems that benefit from on-chip memory and high I/O density, and for projects that require a compact BGA package combined with industrial-grade operating limits. Sourcing this FPGA from a major manufacturer helps ensure continuity for long-term designs.

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