EP4SGX360KF40I3G

IC FPGA 744 I/O 1517FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,189 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360KF40I3G – Field Programmable Gate Array (FPGA) IC

The EP4SGX360KF40I3G is a Stratix IV family FPGA offering a high-density programmable fabric with 353,600 logic elements and approximately 23.1 Mbits of embedded memory. Designed for industrial-grade applications, the device provides extensive I/O capability (744 I/O pins), a compact 1517‑FBGA (40×40) package, and an operating temperature range from −40 °C to 100 °C.

This device is targeted at designs that require significant logic capacity, on-chip memory resources, and robust I/O integration while operating from a low-voltage core supply (870 mV to 930 mV). It leverages the Stratix IV architecture and associated family features such as advanced clocking, DSP blocks, and high-speed transceiver functionality described in the Stratix IV device handbook.

Key Features

  • High-density logic — 353,600 logic elements to implement complex custom logic, state machines, and data-paths on a single device.
  • Embedded memory — Approximately 23.1 Mbits of on-chip RAM to support buffers, frame storage, and low-latency data handling without immediate external memory dependency.
  • Extensive I/O — 744 I/O pins to support wide parallel interfaces, multiple high-speed links, and diverse peripheral connectivity.
  • Stratix IV family architecture — Built on the Stratix IV device family platform, including on-chip clock networks, PLLs, DSP blocks, and high-speed transceiver features as described in the device handbook.
  • Package & mounting — 1517‑FBGA (40×40) FCBGA package in a surface-mount form factor for compact board designs.
  • Industrial temperature grade — Rated for −40 °C to 100 °C operation to meet demanding environmental conditions.
  • Low-voltage core supply — Core operating range of 870 mV to 930 mV to match system power-rail planning.
  • Regulatory compliance — RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

  • High-bandwidth networking — Use the large logic capacity and Stratix IV transceiver and I/O capabilities to implement packet processing, switching logic, and protocol bridging.
  • Signal processing and DSP — Leverage abundant logic and on-chip memory alongside family DSP resources for real-time filtering, encoding/decoding, and data aggregation.
  • External memory interfaces — Act as an interface controller or aggregator for external memory and peripherals, taking advantage of Stratix IV external memory interface features.
  • Industrial automation and control — Deploy in control systems that require sustained operation across a wide temperature range and high I/O counts for sensors, actuators, and fieldbus interfaces.

Unique Advantages

  • Large programmable fabric: 353,600 logic elements enable consolidation of multiple functions onto a single FPGA, reducing board complexity and BOM.
  • Substantial on-chip memory: Approximately 23.1 Mbits of embedded RAM supports buffering and state storage, minimizing early reliance on external memory devices.
  • Broad I/O density: 744 I/O pins allow flexible interface mapping and parallel data paths, easing system partitioning and interface routing.
  • Industrial-grade operation: −40 °C to 100 °C rating and RoHS compliance support deployment in demanding environments and regulated manufacturing flows.
  • Family-level capabilities: Based on the Stratix IV device family, the device benefits from documented features such as advanced clocking, DSP blocks, and high-speed transceiver technologies for complex system integration.
  • Compact, board-ready package: 1517‑FBGA (40×40) surface-mount package helps achieve a compact system footprint while maintaining high pin count.

Why Choose EP4SGX360KF40I3G?

The EP4SGX360KF40I3G positions itself as a high-capacity, industrial-grade FPGA option within the Stratix IV family, combining hundreds of thousands of logic elements, multi-megabit embedded memory, and a large I/O complement in a single FCBGA package. Its documented family features—clock networks, PLLs, DSP blocks, and transceiver support—make it suitable for advanced signal processing, high-throughput interfacing, and complex system control tasks.

This device is well suited for engineering teams designing high-performance, reliable systems that require on-chip integration of logic and memory, broad connectivity, and operation across extended temperature ranges. The use of a Stratix IV family device provides access to family-level documentation and resources to support development and system integration.

Request a quote or submit an inquiry for EP4SGX360KF40I3G to obtain pricing and availability information or to discuss how this device can fit into your next high-density, industrial FPGA design.

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