EP4SGX360KF40C4N

The EP4SGX360KF40C4N is a Stratix® IV GX field programmable gate array (FPGA) optimized for high-density digital designs. It provides a large logic fabric, substantial on-chip memory, and a high pin count in a 1517-BBGA (FCBGA) package for complex system integration.

Targeted at commercial-grade applications, this device delivers a combination of logic capacity, I/O density, and packaging suitable for designs that require significant embedded memory and extensive external interfacing within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity  353,600 logic elements to implement large-scale digital functions and custom processing pipelines.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM to support buffering, packet processing, and data-path storage.
• High I/O Count  744 I/O pins to accommodate multiple parallel interfaces, high-pin-count peripherals, and large connector systems.
• Power Supply Range  Operates from 870 mV to 930 mV supply levels, enabling integration into designs with tightly controlled core voltage rails.
• Package Options  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40) for compact, high-density mounting.
• Commercial Grade & Environmental Compliance  Commercial operating grade with RoHS compliance for standard commercial product deployments.
• Operating Temperature  Rated for 0 °C to 85 °C operation for typical commercial environments.

Typical Applications

• High-density digital processing  Implement custom compute pipelines, signal processing blocks, and parallel logic functions that require extensive logic and embedded RAM.
• Interface aggregation and bridging  Use the 744 I/O pins to consolidate multiple high-pin-count interfaces or implement protocol bridging between subsystems.
• Data buffering and packet handling  Leverage approximately 23.1 Mbits of on-chip memory for packet buffering, queues, and other temporary storage needs in data-path designs.
• Prototype and system integration  Integrate complex FPGA-based subsystems into commercial products where a high logic count and dense packaging are required.

Unique Advantages

• High integration density: 353,600 logic elements reduce the need for multiple devices, simplifying system architecture and lowering BOM complexity.
• Substantial embedded memory: Approximately 23.1 Mbits of RAM enable on-chip buffering and state storage, minimizing external memory requirements.
• Extensive I/O capability: 744 I/O pins support complex interfacing needs, reducing the need for external multiplexers or expansion logic.
• Compact, manufacturable package: The 1517-BBGA (FCBGA) package provides a high pin density in a board-friendly format for surface-mount assembly.
• Commercial readiness and compliance: Commercial grade rating with RoHS compliance aligns with standard commercial product requirements.
• Defined power and thermal envelope: Clear operating voltage (870 mV–930 mV) and temperature range (0 °C–85 °C) simplify power-rail and thermal planning.

Why Choose EP4SGX360KF40C4N?

The EP4SGX360KF40C4N combines a very large logic element count with significant embedded memory and a high I/O complement in a compact 1517-BBGA package, making it well suited for commercial designs that demand dense programmable logic and extensive interfacing. Its defined supply voltage range and commercial operating temperature rating help streamline system-level power and thermal design.

This device is appropriate for designers and procurement teams building complex FPGA-based subsystems where integration density, on-chip memory, and I/O capacity drive architecture decisions. RoHS compliance and a standardized package make it a practical choice for commercial product deployment and assembly workflows.

Request a quote or submit your part requirements to obtain pricing and availability for the EP4SGX360KF40C4N. Our team will respond with ordering details and lead-time information.