EP4SGX360KF40C4
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 23105536 353600 1517-BBGA, FCBGA |
|---|---|
| Quantity | 871 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360KF40C4 – Stratix IV GX FPGA, 353,600 logic elements, 744 I/Os
The EP4SGX360KF40C4 is a Stratix IV GX field-programmable gate array (FPGA) IC offering very high logic capacity and dense I/O in a compact BGA package. It targets designs that require large on-chip logic and memory resources together with a high pin count for system integration.
Architected as a Stratix IV GX device, the product is documented in the Stratix IV Device Handbook and related device datasheets, which include detailed specifications for power, I/O standards, transceivers, clocking, DSP resources and embedded memory.
Key Features
- Core Logic Capacity Provides 353,600 logic elements to support complex digital designs and high-density integration of custom logic.
- Embedded Memory Approximately 23.1 Mbits of on-chip RAM for buffering, packet processing and large local storage requirements.
- High I/O Count 744 user I/Os to accommodate wide parallel interfaces, high-pin-count system connectivity, and dense mezzanine or backplane routing.
- Package and Mounting 1517‑BBGA (FCBGA) supplier package (1517‑FBGA, 40×40); designed for surface-mount assembly in space-constrained boards.
- Power Supply Range Core voltage supply range from 870 mV to 930 mV, enabling precise power budgeting per the device recommended operating conditions.
- Operating Grade and Temperature Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial deployments.
- System and Configuration Features Device documentation includes sections for configuration and JTAG specifications, chip-wide reset behavior, and device-level electrical characteristics.
- Transceivers, DSP and Clocking The device handbook and datasheet content contain performance specifications and detailed sections for transceivers, DSP blocks, PLLs and the clock tree to inform high-performance timing and interface design.
- Standards and Compliance RoHS‑compliant material status for regulatory and manufacturing compatibility.
Typical Applications
- High-density digital processing Implements large-scale custom logic and data-paths where extensive logic elements and on-chip RAM are required.
- High-pin-count system integration Connects to multi-lane interfaces, mezzanine modules or dense peripherals using the 744 I/Os available on the 1517 BGA package.
- Signal processing and acceleration Leverages the documented DSP block and embedded memory resources for compute-intensive on-board processing tasks.
Unique Advantages
- High logic density: 353,600 logic elements allow integration of large functions on a single device, reducing board-level component count.
- Substantial on-chip memory: Approximately 23.1 Mbits of embedded RAM supports extensive buffering and local storage without external memory.
- Extensive I/O capability: 744 I/Os provide flexibility for wide bus interfaces and multiple peripheral connections from a single FPGA footprint.
- Comprehensive device documentation: The Stratix IV Device Handbook and device datasheets supply detailed electrical, timing, transceiver, DSP and configuration specifications to support design and validation.
- Surface-mount BGA packaging: 1517‑BBGA (1517‑FBGA, 40×40) offers a compact form factor suited to space-constrained PCBs while supporting high pin density.
- Regulatory readiness: RoHS compliance helps streamline manufacturing and procurement for standard commercial applications.
Why Choose EP4SGX360KF40C4?
The EP4SGX360KF40C4 combines very large logic capacity, significant embedded memory and a high I/O count in a 1517 BGA package, making it suitable for commercial designs that need integrated, high-density programmable logic and system-level connectivity. Its documented support for transceivers, DSP blocks, PLLs and clock-tree architectures in the device handbook aids engineering teams in implementing complex timing and interface requirements.
This FPGA is appropriate for customers building board-level systems that demand on-chip resources and extensive I/O while remaining within commercial temperature and supply specifications. The detailed datasheet and device handbook provide the technical information required for design, validation and production planning.
Request a quote or submit an inquiry to obtain pricing, availability and additional technical support for EP4SGX360KF40C4.

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