EP4SGX360KF40C4

IC FPGA 744 I/O 1517FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 23105536 353600 1517-BBGA, FCBGA

Quantity 871 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360KF40C4 – Stratix IV GX FPGA, 353,600 logic elements, 744 I/Os

The EP4SGX360KF40C4 is a Stratix IV GX field-programmable gate array (FPGA) IC offering very high logic capacity and dense I/O in a compact BGA package. It targets designs that require large on-chip logic and memory resources together with a high pin count for system integration.

Architected as a Stratix IV GX device, the product is documented in the Stratix IV Device Handbook and related device datasheets, which include detailed specifications for power, I/O standards, transceivers, clocking, DSP resources and embedded memory.

Key Features

  • Core Logic Capacity  Provides 353,600 logic elements to support complex digital designs and high-density integration of custom logic.
  • Embedded Memory  Approximately 23.1 Mbits of on-chip RAM for buffering, packet processing and large local storage requirements.
  • High I/O Count  744 user I/Os to accommodate wide parallel interfaces, high-pin-count system connectivity, and dense mezzanine or backplane routing.
  • Package and Mounting  1517‑BBGA (FCBGA) supplier package (1517‑FBGA, 40×40); designed for surface-mount assembly in space-constrained boards.
  • Power Supply Range  Core voltage supply range from 870 mV to 930 mV, enabling precise power budgeting per the device recommended operating conditions.
  • Operating Grade and Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial deployments.
  • System and Configuration Features  Device documentation includes sections for configuration and JTAG specifications, chip-wide reset behavior, and device-level electrical characteristics.
  • Transceivers, DSP and Clocking  The device handbook and datasheet content contain performance specifications and detailed sections for transceivers, DSP blocks, PLLs and the clock tree to inform high-performance timing and interface design.
  • Standards and Compliance  RoHS‑compliant material status for regulatory and manufacturing compatibility.

Typical Applications

  • High-density digital processing  Implements large-scale custom logic and data-paths where extensive logic elements and on-chip RAM are required.
  • High-pin-count system integration  Connects to multi-lane interfaces, mezzanine modules or dense peripherals using the 744 I/Os available on the 1517 BGA package.
  • Signal processing and acceleration  Leverages the documented DSP block and embedded memory resources for compute-intensive on-board processing tasks.

Unique Advantages

  • High logic density: 353,600 logic elements allow integration of large functions on a single device, reducing board-level component count.
  • Substantial on-chip memory: Approximately 23.1 Mbits of embedded RAM supports extensive buffering and local storage without external memory.
  • Extensive I/O capability: 744 I/Os provide flexibility for wide bus interfaces and multiple peripheral connections from a single FPGA footprint.
  • Comprehensive device documentation: The Stratix IV Device Handbook and device datasheets supply detailed electrical, timing, transceiver, DSP and configuration specifications to support design and validation.
  • Surface-mount BGA packaging: 1517‑BBGA (1517‑FBGA, 40×40) offers a compact form factor suited to space-constrained PCBs while supporting high pin density.
  • Regulatory readiness: RoHS compliance helps streamline manufacturing and procurement for standard commercial applications.

Why Choose EP4SGX360KF40C4?

The EP4SGX360KF40C4 combines very large logic capacity, significant embedded memory and a high I/O count in a 1517 BGA package, making it suitable for commercial designs that need integrated, high-density programmable logic and system-level connectivity. Its documented support for transceivers, DSP blocks, PLLs and clock-tree architectures in the device handbook aids engineering teams in implementing complex timing and interface requirements.

This FPGA is appropriate for customers building board-level systems that demand on-chip resources and extensive I/O while remaining within commercial temperature and supply specifications. The detailed datasheet and device handbook provide the technical information required for design, validation and production planning.

Request a quote or submit an inquiry to obtain pricing, availability and additional technical support for EP4SGX360KF40C4.

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