EP4SGX360HF35I3N

The EP4SGX360HF35I3N is a Stratix® IV GX field programmable gate array (FPGA) offered in an industrial-grade, surface-mount 1152‑BBGA package. It combines high logic capacity with abundant I/O and substantial on-chip memory to support designs that require dense programmable logic and wide connectivity.

Key attributes visible from the device specification include 353,600 logic elements, approximately 23 Mbits of embedded RAM, a 564-pin I/O capability, and an operating temperature range suitable for industrial environments.

Key Features

• Core Logic Capacity  353,600 logic elements and 14,144 logic array blocks provide significant programmable logic resources for complex designs.
• Embedded Memory  Approximately 23 Mbits of on-chip RAM for buffering, temporary storage, and logic‑local data structures.
• I/O and Connectivity  564 user I/O pins accommodate high-pin-count interfaces and multiple parallel or serialized connections.
• Power  Specified supply voltage range of 870 mV to 930 mV to match target core power domains.
• Package and Mounting  1152‑BBGA (1152‑FBGA, 35×35) surface-mount package suited to high-density board layouts.
• Temperature Grade  Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliance  Device is RoHS compliant for lead-free assembly processes.

Typical Applications

• High-density programmable logic systems  Use where a large number of logic elements and substantial embedded memory are required to implement complex logic and control functions.
• Industrial control and automation  Industrial temperature rating (−40 °C to 100 °C) supports deployment in factory and process-control equipment.
• High‑I/O subsystem boards  564 I/O pins enable designs that require multiple interfaces, parallel data paths, or extensive sensor/actuator connectivity.
• Compact, high-pin-count designs  The 1152‑BBGA (35×35) surface-mount package supports dense PCB routing while keeping a small board footprint.

Unique Advantages

• High logic density: 353,600 logic elements deliver the capacity to implement large, complex designs without external programmable logic.
• Substantial on-chip memory: Approximately 23 Mbits of embedded RAM reduces reliance on off-chip memory for buffering and streaming data.
• Extensive I/O count: 564 I/O pins provide flexibility to interface with multiple peripherals and high-throughput data paths.
• Industrial temperature capability: Rated from −40 °C to 100 °C for reliable operation across a wide range of environmental conditions.
• Compact BGA packaging: 1152‑BBGA (35×35) package enables high-density board layouts while supporting surface-mount assembly.
• Controlled core power range: Specified 870 mV to 930 mV supply window aligns with defined core voltage requirements for stable operation.

Why Choose EP4SGX360HF35I3N?

The EP4SGX360HF35I3N positions itself as a high-capacity, industrial-grade FPGA option for designs that demand significant programmable logic, ample on-chip memory, and a high I/O count in a compact BGA package. Its specified operating temperature range and RoHS compliance make it suitable for long-lived, production-level systems.

This device is well suited for engineering teams designing complex, high-density logic systems that require robust integration and predictable electrical and thermal characteristics. The combination of logic capacity, memory, I/O, and package density provides scalability and integration benefits for demanding embedded applications.

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