EP4SGX360HF35I3

The EP4SGX360HF35I3 is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel, offering a high-density programmable logic fabric with substantial embedded memory and a large I/O count. It is supplied in a 1152-FBGA (35 × 35) surface-mount package and is specified for industrial-grade operation.

With 353,600 logic elements and approximately 23 Mbits of on-chip RAM, this device targets designs that require dense logic resources, significant embedded memory, and broad I/O connectivity while operating from a low-voltage core supply of 0.87 V to 0.93 V across an extended temperature range of −40 °C to 100 °C.

Key Features

• Core Capacity — 353,600 logic elements provide high-density programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 23 Mbits of on-chip RAM supports large buffering, state storage, and memory-intensive logic functions.
• I/O and Connectivity — 564 I/O pins enable extensive external device interfacing and high pin-count system integration.
• Power — Core voltage supply specified from 870 mV to 930 mV to support low-voltage system designs.
• Package and Mounting — 1152-BBGA (FCBGA) 35 × 35 surface-mount package for compact, high-density board implementations.
• Operating Temperature and Grade — Industrial-grade specification with an operating range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance — RoHS compliant, meeting common environmental requirements for electronic components.

Typical Applications

• High-density digital processing — Use the large logic capacity and embedded RAM to implement complex custom datapaths and control logic.
• I/O-intensive systems — Leverage 564 I/O pins for designs requiring broad external interfacing, multi-channel data capture, or large bus connectivity.
• Industrial control and instrumentation — Industrial-grade temperature range and rugged package support deployment in factory automation and instrumentation equipment.
• FPGA-based prototyping — Dense logic and memory resources make the device suitable for prototyping and validation of large hardware designs.

Unique Advantages

• High logic density: 353,600 logic elements enable implementation of complex systems on a single device, reducing component count.
• Substantial embedded memory: Approximately 23 Mbits of on-chip RAM minimizes dependency on external memory for many applications.
• Extensive I/O: 564 I/O pins simplify integration with peripherals, sensors, and high-channel-count interfaces.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging environments.
• Compact FCBGA package: 1152-FBGA (35 × 35) packaging supports space-constrained PCB layouts while providing high pin density.
• Low-voltage core supply: 0.87 V–0.93 V core supply supports low-voltage system architectures.

Why Choose EP4SGX360HF35I3?

The EP4SGX360HF35I3 positions itself as a high-density, industrial-grade FPGA solution combining a large logic fabric, substantial embedded memory, and a high I/O count in a compact FCBGA package. These attributes make it well suited for engineers designing complex digital systems that require integrated memory and broad external interfacing while meeting extended temperature requirements.

Manufactured by Intel and RoHS compliant, this device delivers a balance of integration and robustness for long-term deployments where scalability, reliable operation across temperature extremes, and compact board-level implementation are priorities.

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