EP4SGX360HF35C3N

The EP4SGX360HF35C3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152-ball FCBGA package sized 35×35 mm. It provides a high logic capacity and substantial on-chip memory with a large I/O count, packaged for surface-mount assembly in commercial-temperature applications.

This device is targeted at designs that require large numbers of logic elements, significant embedded RAM, and extensive I/O connectivity while operating within a 0 °C to 85 °C range and a core voltage window of 870 mV to 930 mV.

Key Features

• Core Architecture Stratix® IV GX FPGA device architecture provided by Intel in a 1152-FBGA (35×35) surface-mount package.
• Logic Capacity 353,600 logic elements to implement large-scale digital designs and complex logic functions.
• Embedded Memory Approximately 23.1 Mbits of total on-chip RAM to support buffering, local storage, and memory-intensive processing.
• I/O Count 564 user I/O pins to support high-pin-count interfaces and multi-channel connectivity.
• Power Core supply voltage range of 870 mV to 930 mV for the device's internal power domain.
• Package & Mounting 1152-BBGA / FCBGA package, supplier device package listed as 1152-FBGA (35×35), designed for surface-mount PCB assembly.
• Operating Range & Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High-density digital processing — Deploy the device where large logic element counts and embedded RAM are needed for complex FPGA-based compute or control logic.
• Multi-channel I/O systems — Use the 564 I/Os for systems requiring extensive parallel interfaces or multi-port connectivity.
• Compact, surface-mount designs — The 1152-FBGA (35×35) package enables high-density PCB layouts while maintaining surface-mount assembly compatibility.

Unique Advantages

• High logic density: 353,600 logic elements enable implementation of large, feature-rich digital designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 23.1 Mbits of RAM reduces dependence on external memory for buffering and intermediate storage.
• Extensive I/O availability: 564 user I/Os support complex interface requirements and multiple peripheral connections.
• Compact FBGA package: 1152-ball FCBGA (35×35) offers a compact footprint for space-constrained, high-density boards.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.
• Low-voltage core operation: Core supply window of 870 mV to 930 mV for integration into modern power-optimized systems.

Why Choose EP4SGX360HF35C3N?

The EP4SGX360HF35C3N positions itself for engineers and procurement teams seeking a high-capacity Stratix® IV GX FPGA from Intel that balances large logic fabric, significant embedded memory, and broad I/O in a surface-mount FBGA package. Its combination of 353,600 logic elements, approximately 23.1 Mbits of on-chip RAM, and 564 I/Os makes it well suited to demanding commercial designs that require concentrated logic and memory resources within a compact package.

Designed for commercial-temperature operation and RoHS compliance, this device offers a clear specification set for projects that need scalable logic density and extensive connectivity while conforming to standard surface-mount manufacturing practices.

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