EP4SGX360HF35C3

The EP4SGX360HF35C3 is a Stratix IV GX field programmable gate array (FPGA) device from Intel. It implements a high-density FPGA fabric optimized for designs that require large logic capacity, substantial on-chip memory, and extensive I/O connectivity.

Built on the Stratix IV GX device family architecture, this commercial-grade, surface-mount FCBGA package targets high-performance digital logic, high-bandwidth serial interfaces, and complex system integration where logic density and embedded memory are primary design drivers.

Key Features

• Core logic density — 353,600 logic elements provide significant programmable logic capacity for large designs and system consolidation.
• Embedded memory — approximately 23.1 Mbits of embedded memory to support on-chip buffering, lookup tables, and state storage.
• High I/O count — 564 user I/O pins to support broad interfacing and complex board-level connectivity.
• Stratix IV GX architecture features — device handbook headings indicate support for high-speed transceivers, DSP blocks, PLLs, clock networks, and robust I/O features for signal integrity and protocol support.
• Package and mounting — 1152-BBGA / FCBGA package; supplier device package listed as 1152-FBGA (35×35) for surface-mount assembly.
• Supply and temperature — core voltage supply range 870 mV to 930 mV and commercial operating temperature range 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-bandwidth data interfaces — use the device where large I/O counts and Stratix IV GX transceiver and I/O capabilities are required for handling complex serial and parallel interfaces.
• Digital signal processing — leverage the device’s large logic capacity and embedded memory for DSP algorithms and real-time data manipulation.
• System consolidation — integrate multiple board-level functions into one FPGA to reduce component count using the available logic elements and on-chip RAM.

Unique Advantages

• High logic capacity: 353,600 logic elements enable implementation of large, complex designs without immediate partitioning across multiple devices.
• Substantial on-chip memory: approximately 23.1 Mbits of embedded memory supports buffering, packet storage, and lookup tables to reduce external memory dependence.
• Extensive I/O connectivity: 564 I/O pins accommodate multiple interfaces and wide parallel buses for flexible system integration.
• Commercial temperature rating: 0 °C to 85 °C provides predictable operating behavior for standard commercial applications.
• Surface-mount FCBGA package: 1152-FBGA (35×35) packaging supports compact board layouts and dense PCB integration.
• Controlled core supply range: 0.87–0.93 V core supply enables designers to account for precise power sequencing and thermal planning.

Why Choose EP4SGX360HF35C3?

The EP4SGX360HF35C3 positions itself as a high-density Stratix IV GX FPGA option for designs that require substantial programmable logic, significant embedded memory, and a large I/O complement in a single commercial-grade package. Its combination of logic elements, on-chip RAM, and the family-level support for transceivers, DSP resources, and clocking structures makes it suitable for demanding digital processing and high-bandwidth interface tasks.

For engineering teams focused on reducing board-level complexity and consolidating functions into a single FPGA, EP4SGX360HF35C3 delivers the capacity and I/O needed to implement complex systems while remaining within commercial operating conditions and RoHS compliance.

Request a quote or submit a pricing inquiry to evaluate EP4SGX360HF35C3 for your next design and get detailed ordering and lead-time information.