EP4SGX360HF35C2
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 23105536 353600 1152-BBGA, FCBGA |
|---|---|
| Quantity | 8 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360HF35C2 – Stratix® IV GX Field Programmable Gate Array (1152-BBGA)
The EP4SGX360HF35C2 is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel. It combines large on-chip logic capacity, substantial embedded memory, and a high I/O count in a high-density FCBGA package to address complex digital designs.
This commercial-grade device is intended for designs that require significant logic resources and large memory bandwidth within a surface-mount 1152-BBGA (35 × 35) footprint, operating over a commercial temperature range.
Key Features
- Logic Capacity — 353,600 logic elements, providing substantial programmable logic resources for complex functions and custom architectures.
- Embedded Memory — Approximately 23.1 Mbits of on-chip RAM to support large buffers, FIFOs, and local storage for data-path and control logic.
- I/O Density — 564 I/O pins to support high-channel-count interfaces and flexible board-level connectivity.
- Power Supply — Core voltage range from 870 mV to 930 mV, supporting defined power domains for the device core.
- Package & Mounting — 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35 × 35 mm) in a surface-mount form factor for compact PCB integration.
- Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant, meeting common lead-free and hazardous substances requirements.
Unique Advantages
- High on-chip resource density: 353,600 logic elements and ~23.1 Mbits of embedded memory provide the capacity to integrate large portions of system logic on a single device, reducing external component count.
- Extensive I/O capability: 564 I/Os enable connectivity to multiple peripherals, interfaces, and high-pin-count daughtercards without immediate need for external multiplexing.
- Compact board footprint: 1152-FBGA (35 × 35) package offers a high pin-count in a single compact surface-mount package, aiding miniaturized system designs.
- Commercial temperature operation: Rated 0 °C to 85 °C for applications and deployments that operate within standard commercial environments.
- Regulatory readiness: RoHS compliance supports lead-free manufacturing and common environmental requirements.
Why Choose EP4SGX360HF35C2?
The EP4SGX360HF35C2 delivers a balanced combination of large logic capacity, significant embedded memory, and a high number of I/Os in a compact FCBGA package. As a commercial-grade Stratix® IV GX FPGA from Intel, it is well suited to designs that need substantial programmable resources and dense I/O in a surface-mount form factor within a 0 °C to 85 °C operating range.
Choosing this device supports consolidation of system functions into a single FPGA, helping simplify BOMs and streamline board layouts while meeting common environmental compliance requirements.
Request a quote or submit an RFQ to receive pricing and availability information for EP4SGX360HF35C2.

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