EP4SGX360HF35C2

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 23105536 353600 1152-BBGA, FCBGA

Quantity 8 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360HF35C2 – Stratix® IV GX Field Programmable Gate Array (1152-BBGA)

The EP4SGX360HF35C2 is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel. It combines large on-chip logic capacity, substantial embedded memory, and a high I/O count in a high-density FCBGA package to address complex digital designs.

This commercial-grade device is intended for designs that require significant logic resources and large memory bandwidth within a surface-mount 1152-BBGA (35 × 35) footprint, operating over a commercial temperature range.

Key Features

  • Logic Capacity — 353,600 logic elements, providing substantial programmable logic resources for complex functions and custom architectures.
  • Embedded Memory — Approximately 23.1 Mbits of on-chip RAM to support large buffers, FIFOs, and local storage for data-path and control logic.
  • I/O Density — 564 I/O pins to support high-channel-count interfaces and flexible board-level connectivity.
  • Power Supply — Core voltage range from 870 mV to 930 mV, supporting defined power domains for the device core.
  • Package & Mounting — 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35 × 35 mm) in a surface-mount form factor for compact PCB integration.
  • Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant, meeting common lead-free and hazardous substances requirements.

Unique Advantages

  • High on-chip resource density: 353,600 logic elements and ~23.1 Mbits of embedded memory provide the capacity to integrate large portions of system logic on a single device, reducing external component count.
  • Extensive I/O capability: 564 I/Os enable connectivity to multiple peripherals, interfaces, and high-pin-count daughtercards without immediate need for external multiplexing.
  • Compact board footprint: 1152-FBGA (35 × 35) package offers a high pin-count in a single compact surface-mount package, aiding miniaturized system designs.
  • Commercial temperature operation: Rated 0 °C to 85 °C for applications and deployments that operate within standard commercial environments.
  • Regulatory readiness: RoHS compliance supports lead-free manufacturing and common environmental requirements.

Why Choose EP4SGX360HF35C2?

The EP4SGX360HF35C2 delivers a balanced combination of large logic capacity, significant embedded memory, and a high number of I/Os in a compact FCBGA package. As a commercial-grade Stratix® IV GX FPGA from Intel, it is well suited to designs that need substantial programmable resources and dense I/O in a surface-mount form factor within a 0 °C to 85 °C operating range.

Choosing this device supports consolidation of system functions into a single FPGA, helping simplify BOMs and streamline board layouts while meeting common environmental compliance requirements.

Request a quote or submit an RFQ to receive pricing and availability information for EP4SGX360HF35C2.

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