EP4SGX360HF35C2G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 175 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360HF35C2G – Field Programmable Gate Array (FPGA) IC
The EP4SGX360HF35C2G is a high-density Field Programmable Gate Array manufactured by Intel. It is part of the Stratix IV device family described in the Stratix IV Device Handbook and provides a programmable logic core with on-chip embedded memory and extensive I/O for demanding digital designs.
Typical use cases include high-bandwidth packet processing, protocol bridging, complex signal processing, and other applications that require substantial logic resources, embedded memory and broad I/O connectivity. The device delivers performance and integration appropriate for commercial-grade systems.
Key Features
- Logic Capacity Provides 353,600 logic elements for large-scale custom logic implementations and complex design mapping.
- Embedded Memory Includes approximately 23.1 Mbits of on-chip RAM to support buffering, lookup tables and local data storage.
- I/O Density Up to 564 I/O pins to support wide external connectivity and multiple parallel interfaces.
- Stratix IV Family Capabilities Per the Stratix IV device handbook, the family includes features such as high-speed transceiver support, DSP blocks, PLLs and flexible clock networks for system-level integration.
- Power Core supply operates between 870 mV and 930 mV, enabling compatibility with low-voltage system cores.
- Package & Mounting Supplied in a 1152-FBGA (35×35) package; mounting type is surface mount (1152-BBGA, FCBGA footprint information included).
- Temperature & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- High-Speed Networking Implement packet processing, protocol adaptation and line-rate logic using the device’s large logic capacity and the Stratix IV high-speed transceiver capabilities described in the device handbook.
- Video and Broadcast Processing Use the abundant logic and on-chip RAM for frame buffering, preprocessing and real-time pipeline tasks where sustained throughput is required.
- Wireless Infrastructure Leverage embedded memory and DSP-oriented architecture elements in the Stratix IV family for baseband processing and protocol handling in commercial wireless equipment.
- Test & Measurement Employ high I/O count and flexible clocking to build custom acquisition, timing, and protocol test systems.
Unique Advantages
- High Logic Density: 353,600 logic elements provide headroom for large, multi-function designs without partitioning across multiple devices.
- Substantial On-Chip RAM: Approximately 23.1 Mbits of embedded memory reduces reliance on external RAM for buffering and lookup operations.
- Extensive I/O Count: 564 available I/O pins enable broad peripheral and bus connectivity in a single device.
- Low-Voltage Core: Nominal core voltage range of 870 mV–930 mV supports integration into low-voltage system architectures.
- Compact BGA Package: 1152-FBGA (35×35) packaging delivers high pin-count in a compact surface-mount footprint for dense board layouts.
- Documented Family Features: Backed by the Stratix IV Device Handbook, which documents architecture elements such as transceivers, DSP blocks and clocking resources useful during design and validation.
Why Choose EP4SGX360HF35C2G?
The EP4SGX360HF35C2G positions itself as a high-density, commercially graded Stratix IV FPGA from Intel suited to applications that require large programmable logic capacity, significant embedded memory and extensive I/O. Its combination of logic resources, on-chip RAM and package options makes it a strong candidate for designs that consolidate multiple functions into a single programmable device.
Engineers and system designers who need scalability, documented architecture-level features (as described in the Stratix IV Device Handbook) and RoHS-compliant hardware will find this device appropriate for demanding commercial applications where performance and integration matter.
Request a quote or submit an inquiry to receive pricing and availability for the EP4SGX360HF35C2G and to discuss how it can fit your next design project.

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