EP4SGX360FH29I4

IC FPGA 289 I/O 780HBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 289 23105536 353600 780-BBGA, FCBGA

Quantity 1,503 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O289Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360FH29I4 – Stratix® IV GX Field Programmable Gate Array (FPGA), 353,600 logic elements

The EP4SGX360FH29I4 is a Stratix® IV GX Field Programmable Gate Array (FPGA) from Intel (Altera) delivered in a 780-BBGA FCBGA package. It provides a high-density programmable fabric combined with on-chip memory, transceiver, DSP and clocking resources as documented in the Stratix IV device handbook.

This device targets designs that require large logic capacity, substantial embedded memory and a comprehensive set of on-chip peripherals while meeting industrial-grade operating conditions and surface-mount package requirements.

Key Features

  • High Logic Capacity — 353,600 logic elements supporting complex, large-scale programmable logic implementations.
  • Embedded Memory — Approximately 23.1 Mbits of on-chip RAM for buffers, FIFOs and local storage.
  • I/O and Package — 289 I/O pins in a 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting type.
  • Power Supply — Core voltage supply range specified at 870 mV to 930 mV.
  • Industrial Temperature Range — Rated operating temperature from −40 °C to 100 °C for industrial applications.
  • Transceivers and High-Speed I/O — Device handbook includes transceiver performance specifications and datapath latency details for high-speed serial interfaces.
  • Clocking and PLLs — Dedicated clock-tree resources and PLL specifications are provided for system clocking and timing control.
  • DSP and Memory Blocks — Documented DSP block specifications and TriMatrix memory block details for signal processing and memory-centric functions.
  • Configuration and Debug — Configuration and JTAG specifications are included for programming and boundary-scan/debug support.
  • RoHS Compliant — Environmentally compliant with RoHS requirements.

Typical Applications

  • High-performance signal processing — Large logic capacity and dedicated DSP block specifications support compute-intensive signal processing and algorithm acceleration.
  • Network and communications equipment — On-chip transceiver and clocking resources, together with abundant embedded memory, suit packet buffering and protocol processing.
  • Data acquisition and instrumentation — Substantial on-chip RAM and flexible I/O enable high-throughput data capture, buffering and preprocessing.
  • Industrial control and automation — Industrial-grade temperature range and robust packaging make the device suitable for demanding control applications that require significant programmable logic.

Unique Advantages

  • High integration density: 353,600 logic elements and approximately 23.1 Mbits of embedded memory reduce external component count and simplify PCB design.
  • Comprehensive on-chip subsystems: Documented transceivers, PLLs, DSP blocks and TriMatrix memory blocks provide a broad set of built-in capabilities for diverse designs.
  • Industrial reliability: Specified operation from −40 °C to 100 °C and a surface-mount 780-BBGA package support deployment in industrial environments.
  • Precise power specifications: Core supply defined between 870 mV and 930 mV to guide power delivery and thermal planning.
  • Standards-based configuration and test: Configuration and JTAG specifications enable standardized programming and boundary-scan testing workflows.

Why Choose EP4SGX360FH29I4?

The EP4SGX360FH29I4 combines a large programmable fabric with substantial embedded memory and documented high-speed subsystems from the Stratix IV GX family. Its industrial operating range, specified supply requirements and BGA package make it a practical choice for engineers building complex, performance-oriented systems where on-chip integration reduces board-level complexity.

This device suits teams designing high-throughput signal-processing, networking, industrial control and data acquisition systems who require a well-documented FPGA platform with integrated transceivers, DSP resources and flexible clocking options.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for EP4SGX360FH29I4. Our team can provide the technical and purchasing details you need to evaluate this FPGA for your next design.

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