EP4SGX360FH29I4
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 289 23105536 353600 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,503 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 289 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360FH29I4 – Stratix® IV GX Field Programmable Gate Array (FPGA), 353,600 logic elements
The EP4SGX360FH29I4 is a Stratix® IV GX Field Programmable Gate Array (FPGA) from Intel (Altera) delivered in a 780-BBGA FCBGA package. It provides a high-density programmable fabric combined with on-chip memory, transceiver, DSP and clocking resources as documented in the Stratix IV device handbook.
This device targets designs that require large logic capacity, substantial embedded memory and a comprehensive set of on-chip peripherals while meeting industrial-grade operating conditions and surface-mount package requirements.
Key Features
- High Logic Capacity — 353,600 logic elements supporting complex, large-scale programmable logic implementations.
- Embedded Memory — Approximately 23.1 Mbits of on-chip RAM for buffers, FIFOs and local storage.
- I/O and Package — 289 I/O pins in a 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting type.
- Power Supply — Core voltage supply range specified at 870 mV to 930 mV.
- Industrial Temperature Range — Rated operating temperature from −40 °C to 100 °C for industrial applications.
- Transceivers and High-Speed I/O — Device handbook includes transceiver performance specifications and datapath latency details for high-speed serial interfaces.
- Clocking and PLLs — Dedicated clock-tree resources and PLL specifications are provided for system clocking and timing control.
- DSP and Memory Blocks — Documented DSP block specifications and TriMatrix memory block details for signal processing and memory-centric functions.
- Configuration and Debug — Configuration and JTAG specifications are included for programming and boundary-scan/debug support.
- RoHS Compliant — Environmentally compliant with RoHS requirements.
Typical Applications
- High-performance signal processing — Large logic capacity and dedicated DSP block specifications support compute-intensive signal processing and algorithm acceleration.
- Network and communications equipment — On-chip transceiver and clocking resources, together with abundant embedded memory, suit packet buffering and protocol processing.
- Data acquisition and instrumentation — Substantial on-chip RAM and flexible I/O enable high-throughput data capture, buffering and preprocessing.
- Industrial control and automation — Industrial-grade temperature range and robust packaging make the device suitable for demanding control applications that require significant programmable logic.
Unique Advantages
- High integration density: 353,600 logic elements and approximately 23.1 Mbits of embedded memory reduce external component count and simplify PCB design.
- Comprehensive on-chip subsystems: Documented transceivers, PLLs, DSP blocks and TriMatrix memory blocks provide a broad set of built-in capabilities for diverse designs.
- Industrial reliability: Specified operation from −40 °C to 100 °C and a surface-mount 780-BBGA package support deployment in industrial environments.
- Precise power specifications: Core supply defined between 870 mV and 930 mV to guide power delivery and thermal planning.
- Standards-based configuration and test: Configuration and JTAG specifications enable standardized programming and boundary-scan testing workflows.
Why Choose EP4SGX360FH29I4?
The EP4SGX360FH29I4 combines a large programmable fabric with substantial embedded memory and documented high-speed subsystems from the Stratix IV GX family. Its industrial operating range, specified supply requirements and BGA package make it a practical choice for engineers building complex, performance-oriented systems where on-chip integration reduces board-level complexity.
This device suits teams designing high-throughput signal-processing, networking, industrial control and data acquisition systems who require a well-documented FPGA platform with integrated transceivers, DSP resources and flexible clocking options.
Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for EP4SGX360FH29I4. Our team can provide the technical and purchasing details you need to evaluate this FPGA for your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018