EP4SGX360FH29C4N

The EP4SGX360FH29C4N is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 780-BBGA (FCBGA) package. It delivers a high logic capacity FPGA fabric with on-chip embedded memory and a comprehensive device datasheet that includes transceiver, DSP and memory block specifications.

This device is targeted at designs that require large programmable logic resources, substantial embedded RAM, and a rich I/O complement—suitable for applications that leverage on-chip DSP blocks, TriMatrix memory, and transceiver performance as documented in the device handbook and datasheet.

Key Features

• High Logic Capacity — 353,600 logic elements to implement large-scale digital designs and complex state machines.
• Embedded Memory — Approximately 23.1 Mbits of on-chip RAM for buffering, FIFOs, and data-path storage.
• I/O Density — 289 user I/O pins to support broad interfacing needs and parallel data paths.
• Series-Level Transceiver and DSP Support — The Stratix IV device documentation includes Transceiver Performance Specifications and DSP Block Specifications for designs that require high-performance datapaths (see the device handbook/datasheet).
• TriMatrix Memory and Clocking — Device handbook lists TriMatrix memory block specifications and clock tree/PLL specifications for synchronized, high-performance systems.
• Power and Voltage — Core supply operating range documented at 870 mV to 930 mV for the device core.
• Package and Mounting — 780-BBGA, FCBGA package (supplier device package: 780-HBGA 33×33); surface-mount mounting type for high-density board designs.
• Commercial Temperature Grade — Operating temperature range of 0 °C to 85 °C for commercial applications.
• RoHS Compliant — Device is RoHS compliant as documented in the product data.

Typical Applications

• High-Speed Communications — Use the device where documented transceiver performance and abundant I/O are needed for protocol implementation and interfacing.
• Signal Processing and DSP — On-chip DSP block specifications and large embedded RAM support data-path acceleration and real-time processing tasks.
• Networking and Switching — Large logic capacity and plentiful I/O enable packet processing, buffering, and complex control logic.
• Instrumentation and Test Equipment — Dense logic and TriMatrix memory support measurement, capture, and real-time analysis functions.

Unique Advantages

• Substantial Logic Resources: 353,600 logic elements provide the headroom needed for complex, multi-function FPGA designs without immediate migration.
• Significant On-Chip Memory: Approximately 23.1 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Comprehensive Device Documentation: The Stratix IV device handbook and datasheet include detailed specifications for transceivers, DSP blocks, PLLs, and memory blocks to aid system design and verification.
• Flexible I/O Count: 289 I/Os accommodate wide parallel interfaces and multiple peripheral connections on a single device.
• Package Density: 780-BBGA (33×33 supplier package) supports high pin count and compact board area for dense system implementations.
• Regulatory Compliance: RoHS compliance supports environmentally conscious designs and regulatory requirements.

Why Choose EP4SGX360FH29C4N?

The EP4SGX360FH29C4N positions itself as a high-capacity Stratix IV GX FPGA option for designs that demand large programmable logic, significant embedded memory, and a well-documented device architecture covering transceivers, DSP blocks, TriMatrix memory, and clocking. Its 780-BBGA package and 289 I/O pins make it suitable for compact, I/O-rich systems in commercial temperature environments.

Backed by the Stratix IV device handbook and datasheet, this device is appropriate for engineering teams building advanced communications, signal-processing, and instrumentation solutions that require clear device specifications and substantial on-chip resources.

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