EP4SGX360FH29C3N

The EP4SGX360FH29C3N is an Intel Stratix® IV GX field programmable gate array (FPGA) supplied in a 780-BBGA FCBGA package. It provides a high logic capacity device with a large complement of embedded memory and a broad I/O count for dense, programmable system designs.

With 353,600 logic elements, approximately 23.1 Mbits of on-chip RAM and 289 I/O pins, this commercial-grade FPGA is suited to designs that require substantial programmable logic, on-chip storage and high I/O density within a surface-mount 33×33 HBGA footprint. The core supply operates in the 870 mV–930 mV range and the device is specified for 0 °C to 85 °C operation.

Key Features

• High Logic Capacity 353,600 logic elements to implement complex digital circuits and large-scale logic designs.
• Embedded Memory Approximately 23.1 Mbits of on-chip RAM to support buffering, lookup tables and state storage without external memory.
• I/O Density 289 general-purpose I/O pins providing flexible connectivity for peripherals, parallel buses and interface logic.
• Power Core supply voltage range of 870 mV–930 mV for devices designed around low-voltage core domains.
• Package & Mounting 780-BBGA (FCBGA) supplier device package in a 33×33 HBGA footprint; surface-mount mounting for board-level assembly.
• Operating Conditions Commercial-grade device rated for 0 °C to 85 °C ambient operation.
• Compliance RoHS-compliant for regulatory and environmental conformity.

Typical Applications

• Complex Digital Systems Implement large state machines, custom datapaths and algorithmic logic where substantial logic elements and embedded RAM are required.
• High-Density I/O Interfaces Bridge and manage multiple parallel or serial interfaces using the device's high I/O count.
• On-Chip Memory Intensive Designs Use the ~23.1 Mbits of embedded RAM for buffering, packet processing, and intermediate storage to reduce reliance on external memory.

Unique Advantages

• Substantial Logic and Memory Integration: Combines 353,600 logic elements with approximately 23.1 Mbits of on-chip RAM to minimize external components and board-level complexity.
• High I/O Count: 289 I/Os enable flexible system interfacing and simplify routing of multiple peripherals or buses.
• Compact Surface-Mount Package: 780-BBGA FCBGA (33×33 HBGA) footprint supports high-density PCB integration in space-constrained designs.
• Commercial-Grade Operating Range: Rated for 0 °C to 85 °C operation to meet standard commercial application environments.
• RoHS-Compliant: Conforms to RoHS requirements to support environmentally constrained designs and procurement.

Why Choose EP4SGX360FH29C3N?

The EP4SGX360FH29C3N positions itself as a high-capacity Stratix® IV GX FPGA offering significant on-chip resources for designs that demand extensive programmable logic, embedded memory and a large number of I/Os. Its combination of 353,600 logic elements, roughly 23.1 Mbits of RAM and 289 I/Os provides designers with the integration needed to consolidate functionality and reduce external component count.

This commercial-grade, RoHS-compliant device in a surface-mount 780-BBGA FCBGA package is appropriate for engineering teams and procurement groups looking for a scalable FPGA platform with defined voltage and temperature specifications for typical commercial environments.

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