EP4SGX360FH29C2XN

The EP4SGX360FH29C2XN is a Stratix IV GX Field Programmable Gate Array (FPGA) manufactured by Intel, provided in a 780-BBGA FCBGA package. It is a high-density FPGA offering 353,600 logic elements and advanced Stratix IV GX family capabilities.

Built for designs that require significant on-chip logic, abundant embedded memory and high I/O counts, this device targets protocol-rich, high-bandwidth applications that benefit from the Stratix IV GX architecture and associated high-speed I/O features.

Key Features

• High Logic Density — 353,600 logic elements to implement large-scale, complex logic and programmable functions on a single device.
• Embedded Memory — Approximately 23.1 Mbits of embedded memory to support buffering, packet storage, and on-chip data processing.
• Rich I/O Count — 289 general-purpose I/O pins to interface with peripherals, memory, and external logic.
• Stratix IV GX Architecture — Part of the Stratix IV GX device family, with architecture and high-speed transceiver features noted in the device handbook.
• Package and Mounting — 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount construction for PCB assembly.
• Power Supply — Core voltage in the range 870 mV to 930 mV for device operation.
• Operating Temperature — Commercial-grade operating range from 0 °C to 85 °C.
• Regulatory Status — RoHS compliant, meeting lead-free requirements for environmental compliance.

Typical Applications

• High-speed networking and communications — Leverages the Stratix IV GX architecture and high-speed I/O capabilities for protocol-rich, bandwidth-intensive interfaces.
• FPGA-based system integration — Use as a central programmable fabric to consolidate logic, I/O routing and embedded memory in complex electronic systems.
• Memory interface and buffering — Large on-chip memory and plentiful I/Os enable external memory interfaces and data buffering tasks.

Unique Advantages

• Large programmable fabric: 353,600 logic elements provide capacity for complex logic, wide datapaths and system-level integration on a single device.
• Significant embedded memory: Approximately 23.1 Mbits of on-chip RAM reduces dependency on external memory for many buffering and processing tasks.
• Extensive I/O support: 289 I/O pins enable broad peripheral and interface connectivity without additional I/O expanders.
• Stratix IV GX family features: Device belongs to the Stratix IV GX family as documented in the device handbook, bringing architecture and high-speed transceiver capabilities to applicable designs.
• Commercial-grade readiness: Surface-mount 780-BBGA package and 0 °C to 85 °C operating range suit standard commercial electronic products and applications.
• Environmental compliance: RoHS compliance supports deployment where lead-free components are required.

Why Choose EP4SGX360FH29C2XN?

The EP4SGX360FH29C2XN positions itself as a high-density Stratix IV GX FPGA option for designs that require substantial logic resources, on-chip memory and a high number of I/Os within a 780-BBGA FCBGA package. Its combination of 353,600 logic elements, approximately 23.1 Mbits of embedded memory and 289 I/Os makes it suitable for consolidating complex functions into a single programmable device.

Designed for engineers and procurement teams building commercial electronic systems, this device offers the capacity and architecture documented in the Stratix IV device handbook while meeting RoHS requirements and standard commercial temperature and power specifications.

Request a quote or submit an inquiry for availability and pricing to evaluate the EP4SGX360FH29C2XN for your next high-density FPGA design.