EP4SGX360FF35I4N

The EP4SGX360FF35I4N is a Stratix IV GX family FPGA packaged in a 1152-BBGA (35 × 35 mm) FCBGA format. It integrates a large programmable fabric with high I/O density and on-chip memory, targeting industrial designs that require dense logic, extensive embedded memory, and robust I/O connectivity.

Built for applications that demand high aggregate bandwidth and flexible protocol support, this device pairs 353,600 logic elements with high-speed transceiver and I/O features described in the Stratix IV device handbook, delivering a platform for custom packet processing, signal processing, and system integration tasks.

Key Features

• Core Capacity  353,600 logic elements provide extensive programmable logic for complex, high-density designs.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM (23,105,536 bits) to support buffering, FIFOs, and memory-intensive processing.
• I/O Density & Connectivity  564 I/Os enable high pin-count interfaces and dense external connectivity for multi-channel systems.
• High-Speed Transceiver & Protocol Support  Stratix IV GX device family features include high-speed transceiver capabilities and support for a wide range of protocols, enabling high aggregate data bandwidth and flexible link implementations.
• DSP, Clocking & System Integration  The device family includes DSP blocks, PLLs, and comprehensive clock networks to support signal processing, timing, and system synchronization functions (as documented in the Stratix IV device handbook).
• Low-Voltage Core  Core supply operates in the 870 mV to 930 mV range, supporting modern low-voltage system architectures.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C and classified as Industrial grade for demanding environments.
• Package & Mounting  1152-BBGA (1152-FBGA, 35 × 35 mm) surface-mount package for compact board-level integration.
• Compliance  RoHS compliant to meet regulatory requirements for lead-free assemblies.

Typical Applications

• High-performance networking & communications  Implement custom packet processing, protocol offload, and multi-lane link aggregation using dense logic and high-speed transceiver features.
• Video and broadcast processing  Leverage large logic capacity and substantial embedded RAM for buffering, format conversion, and multi-channel video pipelines.
• Test & measurement equipment  Use abundant I/Os and DSP/clocking resources for precision data capture, signal conditioning, and real-time analysis.
• Industrial control and instrumentation  Deploy in industrial systems that require extended operating temperature ranges and high I/O counts for sensor and actuator interfaces.

Unique Advantages

• High logic density: 353,600 logic elements enable complex system-on-FPGA implementations and feature-rich designs without partitioning across multiple devices.
• Significant on-chip memory: Approximately 23.1 Mbits of embedded RAM reduces external memory dependence for many buffering and stateful processing tasks.
• Extensive I/O reach: 564 I/Os provide the pin count necessary for multi-channel interfaces and high connector density designs.
• Industrial-grade thermal range: −40 °C to 100 °C rating supports deployment in temperature-demanding environments.
• Low-voltage core operation: 0.87–0.93 V supply supports integration into modern low-voltage power domains.
• Compact, manufacturable package: 1152-BBGA (35 × 35 mm) surface-mount package facilitates dense PCB designs while meeting assembly requirements.

Why Choose EP4SGX360FF35I4N?

The EP4SGX360FF35I4N combines a large programmable fabric, substantial embedded memory, and a high I/O count in a single industrial-grade package, making it suitable for designs that require high integration and dependable operation across a wide temperature range. Its inclusion in the Stratix IV GX family brings documented device features such as high-speed transceivers, DSP resources, PLLs, and sophisticated clocking to support demanding protocol and signal-processing needs.

This device is well suited for engineering teams building high-bandwidth communications systems, advanced signal-processing platforms, and industrial instrumentation where on-chip capacity, I/O flexibility, and thermal robustness translate directly into lower BOM complexity and streamlined system architecture.

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