EP4SGX360FF35I3N

The EP4SGX360FF35I3N is a Stratix IV GX FPGA manufactured by Intel. It delivers a large programmable fabric combined with on-chip memory and extensive I/O to support complex digital logic and system integration.

Device documentation for the Stratix IV series includes detailed specifications for DC and switching characteristics, transceiver and PLL performance, DSP block behavior, and TriMatrix memory block specifications, supporting engineering evaluation and system-level design.

Key Features

• Logic Capacity — 353,600 logic elements to implement high-density FPGA designs and complex custom logic.
• Embedded Memory — Approximately 23 Mbits of embedded memory for buffering, lookup tables, and on-chip data storage.
• I/O Resources — 564 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Series-Level IP and Blocks — Stratix IV series documentation includes transceiver performance specifications, PLL specifications, DSP block specifications, and TriMatrix memory block specifications to guide integration of those functions.
• Power and Core Supply — Core voltage range specified from 870 mV to 930 mV to meet the device's recommended operating conditions.
• Industrial Grade — Rated for industrial operation with an operating temperature range of −40 °C to 100 °C.
• Package — 1152-BBGA (FCBGA) 35 × 35 supplier package for surface-mount PCB assembly.
• Mounting — Surface-mount package suitable for standard PCB assembly processes.

Typical Applications

• Signal processing and DSP systems — Leverage the device's logic capacity and documented DSP block specifications for algorithm acceleration and real-time processing.
• High-density logic integration — Use the large number of logic elements and on-chip memory to consolidate complex digital functions into a single programmable device.
• Interface aggregation and protocol bridging — High I/O count supports multiple parallel interfaces and board-level connectivity requirements.

Unique Advantages

• Substantial logic resources: 353,600 logic elements provide the fabric needed for large-scale custom logic and complex state machines.
• Significant embedded memory: Approximately 23 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O availability: 564 I/O pins enable flexible system interfacing and multi-channel connectivity without immediate external multiplexing.
• Industrial temperature range: −40 °C to 100 °C supports deployment in industrial environments where extended temperature operation is required.
• Comprehensive series documentation: The Stratix IV device handbook provides detailed DC/switching, transceiver, PLL, DSP, and memory block specifications to support design verification and system optimization.
• Robust packaging: 1152-BBGA FCBGA package facilitates high-density board layout and reliable surface-mount integration.

Why Choose EP4SGX360FF35I3N?

The EP4SGX360FF35I3N positions itself as a high-capacity FPGA option within the Stratix IV GX family, combining hundreds of thousands of logic elements, substantial embedded memory, and a high I/O count for complex, integration-heavy designs. Its documented series-level features—covering transceivers, PLLs, DSP blocks, and TriMatrix memory—provide the technical grounding engineers need for system-level planning and performance verification.

This device is suited for customers building large-scale digital systems that require on-chip memory, dense logic, and extensive interfacing, and for teams that rely on detailed device handbook specifications during design, validation, and deployment in industrial temperature environments.

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