EP4SGX360FF35C4N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 23105536 353600 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,146 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360FF35C4N – Stratix® IV GX FPGA, 353,600 logic elements, 564 I/Os
The EP4SGX360FF35C4N is a Stratix® IV GX field programmable gate array (FPGA) in a high-pin-count FCBGA package. It provides a large programmable logic capacity, extensive I/O, and substantial on-chip memory for designs that require significant logic and system connectivity.
With 353,600 logic elements, approximately 23.1 Mbits of embedded memory, and 564 I/Os, this commercial-grade device targets applications that need dense logic resources, broad interfacing, and configurable system-level integration.
Key Features
- Core Logic — 353,600 logic elements deliver large-scale programmable logic capacity for complex digital functions and system integration.
- Embedded Memory — Approximately 23.1 Mbits of on-chip RAM to support buffering, packet processing, and local data storage without immediate dependence on external memory.
- I/O and Connectivity — 564 available I/Os provide extensive system interfacing for high-pin-count designs and rich peripheral connectivity.
- Packaging and Mounting — 1152-BBGA / 1152-FBGA (35×35) FCBGA package in a surface-mount form factor for compact, high-density board implementations.
- Power — Core supply range specified at 870 mV to 930 mV to match supported board-level power domains and regulator designs.
- Operating Range — Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
- Compliance — RoHS-compliant to meet common environmental and manufacturing requirements.
- Stratix IV Device Documentation — The Stratix IV device handbook and datasheet series include device-level specifications covering DC and switching characteristics, transceiver performance, PLLs, DSP block and TriMatrix memory block specifications, clock-tree and core performance details, and configuration/JTAG information relevant to Stratix IV devices.
Typical Applications
- High-speed data interfaces — The device-level documentation includes transceiver and datapath specifications useful for designs that implement high-throughput serial links and protocol interfaces.
- Signal processing and acceleration — Large logic capacity and substantial embedded memory support DSP-style datapaths, packet buffering, and hardware acceleration blocks.
- System integration and prototyping — Extensive I/O and programmable resources make the device suitable for system integration tasks and platform prototyping where many external interfaces must be supported.
Unique Advantages
- Large programmable fabric: 353,600 logic elements allow consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
- Significant on-chip memory: Approximately 23.1 Mbits of embedded RAM minimizes reliance on external memory for local buffering and state storage.
- High I/O count: 564 I/Os enable broad connectivity for multi-interface systems, sensors, and peripherals without extensive bridging logic.
- High-pin-count FCBGA packaging: 1152-ball FBGA (35×35) supports dense routing and signal distribution for complex PCB layouts.
- Commercial operating range: Rated for 0 °C to 85 °C operation to match general embedded and enterprise environments.
- RoHS compliant: Conforms to environmental manufacturing requirements for lead-free production.
Why Choose EP4SGX360FF35C4N?
The EP4SGX360FF35C4N combines substantial programmable logic, ample embedded memory, and a high I/O count in a compact FCBGA package, offering a balanced platform for designs that demand integration and configurability. Its specified core voltage range and commercial temperature rating make it suitable for a wide range of embedded, communications, and processing applications where Stratix IV device-level capabilities are required.
Engineers and system designers seeking a high-density Stratix IV GX FPGA with detailed device-level documentation will find the EP4SGX360FF35C4N aligns with projects that prioritize on-chip resources, connectivity, and adherence to RoHS manufacturing standards.
Request a quote or contact sales to discuss availability, pricing, and how EP4SGX360FF35C4N can fit your next design.

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