EP4SGX360FF35C3G

The EP4SGX360FF35C3G is a Stratix IV family FPGA from Intel, designed for high-density programmable logic applications. It combines a large logic fabric with substantial on-chip memory and extensive I/O to address demanding communications, high-performance computing, and advanced signal processing designs.

With 353,600 logic elements and approximately 23.1 Mbits of embedded memory, this commercial-grade, surface-mount FCBGA device targets systems that require high integration, substantial on-chip resources, and flexible I/O in a single-package solution.

Key Features

• High logic density 353,600 logic elements provide a large programmable fabric for complex logic, state machines, and custom datapaths.
• On-chip memory Approximately 23.1 Mbits of embedded memory support large buffers, FIFOs, and local storage for data-intensive operations.
• Extensive I/O 564 I/O pins enable broad external connectivity for parallel interfaces, memory buses, and mixed-signal front ends.
• Stratix IV device family platform Built on the Stratix IV architecture (device handbook references), which documents family features such as high-speed transceivers, DSP capabilities, clock networks, PLLs, and external memory interfaces.
• Power and supply Specified core voltage range of 870 mV to 930 mV for predictable power planning and supply sequencing.
• Package and mounting 1152-ball FCBGA (1152-BBGA, supplier package 1152-FBGA, 35×35) in a surface-mount format for compact board-level integration.
• Commercial temperature grade Rated for 0 °C to 85 °C operation for standard commercial applications.
• RoHS compliant Meets RoHS requirements for reduced hazardous substances.

Typical Applications

• High-performance networking Implement line-rate packet processing and protocol engines leveraging the device’s large logic capacity and abundant I/O.
• Signal processing and DSP Use the on-chip memory and Stratix IV family DSP resources for real-time filtering, compression, and transform operations.
• External memory controller and bridging Deploy the device as a controller or interface bridge between high-speed memory and system logic using the family’s documented external memory interface features.
• Custom compute accelerators Implement application-specific accelerators that benefit from high logic density and significant embedded RAM for local buffering.

Unique Advantages

• High integration in a single device: 353,600 logic elements and approximately 23.1 Mbits of embedded memory reduce the need for multiple discrete components.
• Large I/O count: 564 I/Os provide flexibility for multi-lane interfaces, parallel buses, and mixed peripheral connections without external multiplexing.
• Robust packaging: 1152-ball FCBGA (35×35) enables dense board integration while supporting the device’s extensive I/O and power requirements.
• predictable power envelope: Core supply range (870 mV–930 mV) allows precise power delivery design and margin planning.
• Commercial readiness: Rated 0 °C to 85 °C and RoHS compliant for mainstream embedded and communications products.
• Stratix IV family capabilities: Family-level features such as high-speed transceivers, DSP blocks, and clocking resources (as documented in the Stratix IV device handbook) provide a platform for complex system designs.

Why Choose EP4SGX360FF35C3G?

The EP4SGX360FF35C3G positions itself as a high-density, feature-rich FPGA for designers who need substantial on-chip logic, embedded memory, and a large I/O complement in a single commercial-grade package. Its alignment with the Stratix IV device family offers documented architecture features useful for communications, signal processing, and compute-accelerator applications.

For system architects and procurement teams, this device offers a scalable platform for advanced designs that require significant programmable resources, predictable power specifications, and a compact FCBGA footprint for board-level integration.

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