EP4SGX360FF35C3

The EP4SGX360FF35C3 is an Intel Stratix IV GX field-programmable gate array (FPGA) in a 1152-ball FCBGA package. It provides a large programmable fabric and on-chip memory suitable for complex digital designs that require high I/O density and significant embedded RAM.

Built for commercial-grade applications, this device targets designs that need high logic capacity, substantial embedded memory, and extensive I/O connectivity while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Logic — 353,600 logic elements to implement complex programmable logic and control functions.
• Embedded Memory — Approximately 23.1 Mbits of on-chip RAM for packet buffering, lookup tables, and intermediate data storage.
• I/O Capacity — 564 general-purpose I/O pins to support dense external interconnect and multi‑lane interfaces.
• Package & Mounting — 1152-ball FCBGA (1152-FBGA, 35×35) package; surface-mount construction for PCB integration.
• Power Supply — Core voltage range specified from 870 mV to 930 mV.
• Temperature & Grade — Commercial grade with an operating range of 0 °C to 85 °C.
• Regulatory — RoHS compliant.
• Series-Level Capabilities — Stratix IV GX family documentation references high-speed transceiver features, DSP blocks, PLLs, clock networks, and external memory interface support for system-level integration and protocol flexibility.

Typical Applications

• High-performance networking — Large logic capacity and extensive I/O support complex packet processing and multi‑lane interconnect implementations.
• Data aggregation and switching — Substantial embedded RAM enables buffering and intermediate-data storage for aggregation tasks.
• High-density I/O controllers — 564 I/O pins accommodate dense board-level interfacing and multi-channel sensor or peripheral connectivity.

Unique Advantages

• Large programmable fabric: 353,600 logic elements provide headroom for complex algorithms, protocol stacks, and control logic.
• Significant on-chip memory: Approximately 23.1 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks.
• High I/O count: 564 I/O pins allow for flexible, high-density system partitioning and direct interfacing to numerous peripherals or transceivers.
• Compact, board-ready package: 1152-ball FCBGA (35×35) surface-mount package supports modern PCB assembly and high-density layouts.
• Commercial operating range: Rated 0 °C to 85 °C to match typical commercial equipment requirements.
• Standards-aware platform: Stratix IV GX family documentation highlights features such as high-speed transceivers, PLLs, and clock networks to assist system designers integrating varied protocols and memory interfaces.

Why Choose EP4SGX360FF35C3?

The EP4SGX360FF35C3 combines a large logic element count, substantial embedded memory, and a very high I/O pin count in a compact FCBGA package, offering a balanced platform for demanding commercial applications that require integrated memory and broad connectivity. Its documented Stratix IV GX family features—such as high-speed transceiver support and advanced clocking resources—support complex system integration tasks.

This device is appropriate for design teams seeking a high-capacity FPGA from Intel's Stratix IV GX family for applications where on-chip RAM, I/O density, and programmable logic scale matter. The commercial temperature rating and RoHS compliance align it with standard commercial manufacturing and environmental requirements.

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