EP4SGX360FF35C2XN

The EP4SGX360FF35C2XN is a Stratix® IV GX field-programmable gate array (FPGA) in a 1152-ball BGA package. It provides a large programmable fabric, extensive on-chip memory and a high I/O count for demanding digital designs.

Documented device features include high-speed transceiver performance, dedicated DSP resources, TriMatrix memory blocks, PLLs and robust configuration and test support. These characteristics make the device suitable for designs that require significant logic density, embedded memory and advanced I/O capability within a commercial temperature range.

Key Features

• Logic Capacity — 353,600 logic elements for large-scale programmable logic integration and complex logic implementation.
• Embedded Memory — Approximately 23.1 Mbits of on-chip RAM (23,105,536 bits) to support buffering, lookup tables and memory-intensive algorithms.
• I/O Density — 564 general-purpose I/Os to support broad peripheral and interface connectivity.
• Package & Mounting — 1152-BBGA (FCBGA) 35×35 supplier package in a surface-mount form factor for compact board-level integration.
• Power Supply — Core voltage supply range of 870 mV to 930 mV as specified for device operation.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for commercial applications.
• High-speed Transceivers — Device handbook sections document transceiver performance specifications and datapath latency, indicating integrated high-speed serial interface capability.
• DSP Blocks — Dedicated DSP block specifications are provided, enabling hardware acceleration of signal-processing functions.
• TriMatrix Memory Blocks — On-chip TriMatrix memory block specifications are included for flexible memory architecture and efficient block memory use.
• Clocking and PLLs — Clock tree and PLL specifications are documented to support precise clock management and multi-clock designs.
• Configuration and Test — Configuration, JTAG and chip-wide reset features are described in the device documentation for reliable programming and debug.
• Regulatory — RoHS compliant.

Typical Applications

• High-speed communication systems — Leverages integrated transceiver performance and dense I/O to implement serial links and protocol processing.
• FPGA-based signal processing — Uses dedicated DSP blocks and large embedded memory to accelerate real-time filtering, transforms and other DSP tasks.
• Complex programmable logic and prototyping — High logic capacity supports hardware emulation, custom accelerators and system integration on a single device.
• Memory-rich buffering and packet processing — Approximately 23.1 Mbits of on-chip RAM enable buffering, packet staging and state storage for networking or data-stream applications.

Unique Advantages

• High logic density: 353,600 logic elements provide the headroom for integrating large, multi-function designs without partitioning across multiple devices.
• Integrated memory resources: Approximately 23.1 Mbits of embedded RAM reduces external memory dependency and simplifies board-level design.
• Extensive I/O and packaging options: 564 I/Os in a 1152-BBGA surface-mount package enable compact boards with broad peripheral connectivity.
• Built-in signal processing capability: Dedicated DSP blocks documented in the device handbook enable efficient implementation of arithmetic-intensive functions.
• Comprehensive device documentation: Detailed handbook sections on PLLs, clocking, transceivers, configuration and JTAG support engineering validation and system integration.
• Commercial temperature grade: Rated for 0 °C to 85 °C for deployment in standard commercial environments.

Why Choose EP4SGX360FF35C2XN?

The EP4SGX360FF35C2XN positions itself as a high-capacity Stratix IV GX FPGA that combines significant programmable logic, substantial embedded memory and extensive I/O in a compact 1152-BBGA package. Its documented transceiver capabilities, DSP resources and clock-management features support complex, high-performance designs that demand integrated processing, buffering and interface density.

This device is well suited to engineering teams and system designers building communication, signal-processing, prototyping or other logic-dense applications in commercial temperature environments who require detailed device documentation and a high level of on-chip integration.

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