EP4SGX360FF35C4

The EP4SGX360FF35C4 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1152-ball FCBGA package. It delivers large programmable logic capacity, extensive on-chip memory, and a high I/O count for demanding digital designs.

With 353,600 logic elements, approximately 23.1 Mbits of embedded RAM, and 564 I/O, this commercial-grade FPGA is suited to systems that require significant logic density, substantial local memory, and a compact surface-mount package.

Key Features

• Core Logic – 353,600 logic elements provide substantial programmable logic capacity for complex digital functions and custom hardware acceleration.
• Embedded Memory – Approximately 23.1 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory for many use cases.
• I/O Density – 564 available I/O pins to support high pin-count interfaces and multiple parallel connections.
• Power – Core voltage supply specified at 870 mV to 930 mV to match platform power requirements.
• Package – 1152-ball BGA, FCBGA supplier device package (1152-FBGA, 35 × 35 mm) in a surface-mount form factor for compact board integration.
• Temperature and Grade – Commercial operating range from 0 °C to 85 °C suitable for standard commercial applications.
• Mounting – Surface mount device for PCB assembly.
• Environmental – RoHS compliant.

Typical Applications

• Complex digital processing – Use the large logic resource pool for custom signal processing, protocol implementation, and hardware acceleration functions.
• High-density I/O systems – 564 I/Os support multi-channel interfaces and parallel data paths in communications and test equipment.
• Embedded memory–intensive designs – Approximately 23.1 Mbits of embedded RAM enables substantial on-chip buffering and temporary data storage for streaming and packetized data.
• Compact, board-level integration – The 1152-ball FCBGA surface-mount package supports space-constrained PCB layouts while delivering high integration.

Unique Advantages

• High logic capacity: 353,600 logic elements allow complex designs to be implemented without partitioning across multiple devices.
• Significant on-chip RAM: Approximately 23.1 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O resources: 564 I/O pins simplify connectivity for multi-port and parallel-interface applications.
• Compact FCBGA packaging: 1152-ball FCBGA (35 × 35 mm) enables dense PCB integration while maintaining a high pin count.
• Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial deployments.
• RoHS compliant: Meets lead-free environmental requirements for modern electronics manufacturing.

Why Choose EP4SGX360FF35C4?

The EP4SGX360FF35C4 combines a very large logic element count with substantial embedded memory and a high I/O count in a compact surface-mount FCBGA package. This balance of integration and capacity makes it appropriate for developers and engineers implementing complex digital systems that require on-chip resources and dense connectivity.

As a commercial-grade Stratix® IV GX FPGA from Intel, it provides a clear platform choice for designs that prioritize logic density, embedded RAM capacity, and board-level integration while meeting RoHS environmental requirements.

Request a quote for EP4SGX360FF35C4 today to evaluate its fit for your next high-density programmable logic design or submit your procurement inquiry to receive pricing and availability information.