EP4SGX360FF35I3

The EP4SGX360FF35I3 is an Intel Stratix® IV GX field-programmable gate array (FPGA) supplied in a 1152-FBGA (35×35) package. It delivers high logic density and a large I/O complement for demanding embedded and system-level designs.

Key device-level specifications include 353,600 logic elements, approximately 23.1 Mbits of embedded memory, 564 user I/O, a core supply range of 870 mV to 930 mV, and industrial-grade operation from −40 °C to 100 °C. The device datasheet documents transceiver, DSP block, PLL, clock-tree and TriMatrix memory block specifications along with configuration and JTAG details for system integration.

Key Features

• Core Logic Density  353,600 logic elements provide the capacity to implement complex digital functions and large-scale FPGA designs.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM for buffering, packet processing, and intermediate data storage.
• High I/O Count  564 user I/O pins to support extensive peripheral, bus and high-speed interface connectivity.
• Package and Mounting  1152-FBGA (35×35) surface-mount package (1152-BBGA, FCBGA case) for high-density board-level integration.
• Power and Voltage  Core voltage supply specified at 870 mV to 930 mV to match core power requirements.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• On-chip Subsystem Specifications (per datasheet)  Datasheet includes detailed specifications for transceivers, PLLs, DSP blocks, TriMatrix memory blocks, clock trees, configuration and JTAG, and temperature sensing diode features to support system design and validation.
• RoHS Compliant  Manufactured to meet RoHS requirements for lead-free assemblies.

Typical Applications

• High-speed serial systems  Leverages the device’s documented transceiver specifications and large I/O complement for serial link implementations and protocol bridging.
• Digital signal processing  On-chip DSP block specifications and substantial logic and memory resources suit signal processing pipelines and compute-intensive algorithms.
• Communications and networking equipment  High logic density and embedded memory support packet processing, buffering and custom protocol logic.
• Industrial control and instrumentation  Industrial temperature rating and robust packaging support deployment in industrial automation and measurement systems.

Unique Advantages

• High integration density: 353,600 logic elements reduce the need for external glue logic and enable consolidated system functions on a single device.
• Substantial embedded memory: Approximately 23.1 Mbits of on-chip RAM simplifies data buffering and state storage without added external memory components.
• Extensive I/O capability: 564 user I/O pins allow broad interfacing options and flexible board-level signal routing.
• Industrial-grade operation: Rated from −40 °C to 100 °C to meet the thermal requirements of demanding environments.
• Comprehensive subsystem documentation: Datasheet coverage of transceivers, PLLs, DSP blocks, TriMatrix memory, and configuration/JTAG assists engineers during design, verification and system integration.
• RoHS compliance: Supports lead-free manufacturing and regulatory requirements for electronic assemblies.

Why Choose EP4SGX360FF35I3?

The EP4SGX360FF35I3 positions itself as a high-density Stratix® IV GX FPGA suitable for engineers needing substantial logic resources, embedded memory and a large I/O footprint in an industrial-grade package. Its documented on-chip subsystems—including transceivers, DSP blocks, PLLs and TriMatrix memory—provide the technical detail required for integration into complex digital and signal-processing systems.

This device is appropriate for designs that require consolidated functionality on a single FPGA, robust thermal range, and compliance with RoHS. The combination of logic, memory, I/O and package choices supports scalable, reliable implementations where detailed datasheet specifications are essential for board- and system-level design decisions.

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