EP4SGX360FF35I4

The EP4SGX360FF35I4 is a Stratix IV GX family FPGA in a 1152-BBGA FCBGA package. It integrates a high-density programmable fabric with dedicated on-chip memory, clocking and transceiver features described in the Stratix IV device handbook.

Targeted at designs requiring high logic capacity, extensive I/O and complex system integration, the device is applicable to high-bandwidth communications, memory-interface subsystems and advanced signal-processing applications where industrial-grade temperature range and precise power requirements are required.

Key Features

• Logic capacity — 353,600 logic elements and 14,144 logic blocks provide large programmable fabric for complex logic and control implementations.
• Embedded memory — Approximately 23 Mbits of on-chip RAM to support buffering, packet processing and local data storage.
• I/O count — 564 user I/O pins to support wide external connectivity and system interfacing.
• High-speed transceiver and protocol support — Device handbook sections describe dedicated high-speed transceiver features and broad protocol support for aggregate data bandwidth and serial interfaces.
• Clocking and PLLs — Integrated clock networks and PLL resources for flexible timing and deterministic system clocks, as documented in the device handbook.
• DSP and system resources — Dedicated DSP block architecture and system integration features for compute-intensive signal processing tasks.
• Power supply — Supported core voltage range from 870 mV to 930 mV for precise power provisioning.
• Package and mounting — 1152-BBGA (supplier package: 1152-FBGA, 35×35) surface-mount FCBGA suitable for compact board-level integration.
• Operating temperature — Industrial-grade operation from −40 °C to 100 °C for deployments in demanding thermal environments.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• High-bandwidth communications — Use the device’s high-speed transceiver features and large I/O count to implement aggregation, protocol bridging and line-rate interfaces.
• External memory interfaces — Implement memory controllers and high-throughput buffering leveraging the device’s embedded RAM and I/O resources.
• Signal processing and DSP — Deploy DSP blocks and abundant logic elements for real-time processing tasks such as filtering, encoding or modulation.
• System integration and prototyping — Large logic capacity and flexible clocking make the device suitable for complex system integration, including multi-function prototypes.

Unique Advantages

• High logic density: 353,600 logic elements support complex algorithm implementation without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 23 Mbits of embedded RAM reduces external memory dependency for intermediate buffering and local storage.
• Extensive I/O: 564 user I/Os enable rich connectivity to peripherals, high-pin-count interfaces and multi-channel designs.
• Industrial temperature range: Rated −40 °C to 100 °C to meet environmental demands in industrial applications.
• Integrated system features: On-chip clock networks, PLLs, DSP resources and transceiver features documented in the Stratix IV handbook simplify implementation of synchronous and high-speed subsystems.
• Compact FCBGA package: 1152-BBGA (35×35) footprint supports high-density board layouts while providing the pin count required for complex designs.

Why Choose EP4SGX360FF35I4?

The EP4SGX360FF35I4 combines large programmable logic capacity, significant embedded memory and extensive I/O in a single industrial-grade FCBGA package. Its documented transceiver, clocking and DSP resources make it suitable for designs that require substantial on-chip processing, high aggregate bandwidth and flexible system integration.

This device is well suited to engineering teams building high-bandwidth communications equipment, memory-interface subsystems and compute-heavy signal-processing applications that require scalable logic resources and robust operating-temperature margins. The Stratix IV family handbook provides the design details and architecture guidance necessary to integrate the device into complex systems.

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