EP4SGX360FH29C2XG

The EP4SGX360FH29C2XG is a high-density FPGA IC from Intel supplied as a surface-mount FCBGA/HBGA package. It provides a large programmable fabric together with substantial on-chip memory and a broad I/O count for demanding digital designs.

Targeted at commercial applications, this device combines 353,600 logic elements and approximately 23.1 Mbits of embedded memory with 289 available I/Os, offering designers significant integration capability in a 780-pin BGA (33×33) footprint while operating from a low-voltage supply of 870 mV to 930 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

• High-density logic — 353,600 logic elements provide a large programmable fabric for complex logic, control and processing functions.
• Embedded memory — Approximately 23.1 Mbits of on-chip RAM to support buffering, lookup tables and local data storage without immediate external memory dependency.
• Generous I/O — 289 I/O pins enable multiple parallel interfaces, peripheral connections and board-level signal routing.
• Compact package — Available in a 780-pin BBGA / FCBGA package (supplier designation 780-HBGA, 33×33) for high-pin-count designs in a compact surface-mount form factor.
• Low-voltage operation — 870 mV to 930 mV supply range supports designs optimized for low-voltage systems.
• Commercial grade and RoHS compliant — Specified for 0 °C to 85 °C operation and compliant with RoHS environmental requirements.
• Documented architecture — Device family documentation covers architecture features such as embedded memory, DSP resources, clock networks and I/O capabilities to aid system integration and design planning.

Typical Applications

• High-speed communications — Use the device’s high logic density and documented I/O capabilities to implement protocol processing, bridging or packet handling functions.
• Signal processing and DSP — Substantial embedded memory and large logic fabric suit applications that require local buffering, algorithm implementation and custom data pipelines.
• Memory interface and controllers — Combine on-chip RAM and abundant I/O to create external memory interfaces, controllers and buffering logic for system-level memory management.

Unique Advantages

• Large programmable fabric: 353,600 logic elements enable integration of complex custom logic and multiple functions on a single device, reducing board-level component count.
• Significant on-chip memory: Approximately 23.1 Mbits of embedded RAM supports local data storage and high-throughput buffering without immediate external memory.
• High I/O capacity: 289 I/Os allow flexible interfacing to peripherals, parallel buses and external devices, simplifying system partitioning.
• Space-efficient packaging: 780-pin HBGA (33×33) surface-mount package provides high pin-density in a compact footprint suitable for space-constrained PCBs.
• Low-voltage compatibility: Narrow supply window (870 mV–930 mV) enables designs that align with low-voltage power domains.
• Commercial-grade reliability and compliance: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose EP4SGX360FH29C2XG?

EP4SGX360FH29C2XG positions itself as a high-capacity FPGA option for commercial systems that require dense logic resources, ample embedded memory and a large I/O complement in a compact BGA package. The device’s specifications—353,600 logic elements, approximately 23.1 Mbits of on-chip RAM, 289 I/Os and a 780-pin HBGA footprint—make it suitable for integrated digital designs where consolidation and board-level integration are priorities.

Backed by device-family documentation that details architecture elements such as embedded memory, DSP resources, clocking and I/O capabilities, this FPGA supports development workflows that demand predictable electrical and thermal parameters (870 mV–930 mV supply, 0 °C–85 °C operating range) and RoHS compliance for commercial product lines.

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