EP4SGX360HF35C4

The EP4SGX360HF35C4 is a Stratix IV GX field programmable gate array offered in a 1152-BBGA (35 × 35 mm) FCBGA package. It delivers extremely high logic capacity and a large I/O count for demanding, programmable-logic applications.

With 353,600 logic elements, approximately 23.1 Mbits of embedded memory, and 564 user I/O, this commercial-grade FPGA targets designs that require high integration density, extensive on-chip memory, and broad I/O connectivity while operating within a 0 °C to 85 °C range and a core supply between 870 mV and 930 mV.

Key Features

• Core Logic  353,600 logic elements to implement complex digital logic, state machines, and custom processing pipelines.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM for buffering, packet storage, and local data scratchpad requirements.
• High I/O Count  564 user I/O pins enabling extensive external interfacing and parallel connectivity.
• Package & Mounting  1152-BBGA FCBGA package (supplier package 1152-FBGA, 35 × 35 mm) designed for standard surface-mount assembly.
• Power  Core supply voltage specified from 870 mV to 930 mV, allowing precise power budgeting at the FPGA core.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications and environments.
• Standards & Compliance  RoHS compliant.
• Documentation Coverage  The Stratix IV device handbook includes detailed sections on DC and switching characteristics, power consumption, transceiver and PLL specifications, DSP and memory block specifications, configuration and JTAG, and temperature sensing—useful references for system design and validation.

Typical Applications

• High-density digital processing  Implements large-scale custom logic, parallel datapaths, and complex state machines using extensive logic element resources and embedded RAM.
• Connectivity and I/O aggregation  Aggregates and routes numerous external signals with 564 I/O for bridging multiple peripherals or parallel interfaces.
• Prototyping and system integration  Suitable for validating complex SoC concepts and integrating custom accelerators where high logic capacity and on-chip memory are required.

Unique Advantages

• Extensive logic capacity: 353,600 logic elements provide the headroom to implement large, complex designs without immediate partitioning across multiple devices.
• Substantial on-chip memory: Approximately 23.1 Mbits of embedded RAM reduce dependence on external memory for buffering and local data storage, simplifying board-level design.
• Large I/O footprint: 564 I/O pins enable broad external interfacing and support high parallelism for system-level connectivity.
• Surface-mount FCBGA packaging: 1152-BBGA (35 × 35 mm) package provides a compact, assembly-friendly form factor for high-density PCBs.
• Commercial temperature rating: Operates across 0 °C to 85 °C, appropriate for a wide range of commercial deployments.
• Documented design resources: Comprehensive device handbook content covering electrical characteristics, transceiver and PLL specs, memory and DSP block descriptions, and configuration/JTAG details to support development and validation.

Why Choose EP4SGX360HF35C4?

The EP4SGX360HF35C4 positions itself as a high-capacity, high-I/O Stratix IV GX FPGA for commercial designs that demand extensive logic, on-chip memory, and broad connectivity. Its combination of 353,600 logic elements, approximately 23.1 Mbits of embedded RAM, and 564 I/O supports complex processing, buffering and interface aggregation within a single, surface-mount FCBGA package.

Design teams targeting scalable, integrated FPGA solutions will find the detailed device handbook and the device’s documented electrical and functional specifications useful for system-level planning, power budgeting (870–930 mV core), and thermal qualification within commercial temperature limits.

Request a quote or submit an inquiry for pricing and availability of the EP4SGX360HF35C4 to evaluate fit for your next design.