EP4SGX290NF45I3

IC FPGA 920 I/O 1932FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 17661952 291200 1932-BBGA, FCBGA

Quantity 946 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O920Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290NF45I3 – Stratix® IV GX Field Programmable Gate Array (FPGA)

The EP4SGX290NF45I3 is a Stratix® IV GX FPGA offering a high-density programmable fabric optimized for complex, I/O‑heavy industrial designs. It combines 291,200 logic elements with approximately 17.66 Mbits of embedded memory and 920 user I/O to support large-scale digital logic, buffering and interface integration.

Designed for surface‑mount deployment, this device operates from a core supply range of 0.87–0.93 V and is rated for industrial temperature operation from -40 °C to 100 °C, making it suitable for robust embedded applications that require significant logic capacity and on‑chip memory.

Key Features

  • Logic Capacity  291,200 logic elements provide substantial programmable resources for complex state machines, datapath logic and custom compute blocks.
  • Embedded Memory  Approximately 17.66 Mbits of on‑chip RAM to support buffering, FIFOs and local data storage without external memory in many designs.
  • High I/O Count  920 user I/O pins enable extensive external interfacing for multi‑lane transceivers, parallel buses, or mixed signal front‑ends.
  • Power and Core Voltage  Core supply range of 0.87–0.93 V allows precise power provisioning for the FPGA fabric.
  • Package and Mounting  1932‑ball BGA (FCBGA), 45 × 45 mm footprint in a surface‑mount package for compact, high‑pin‑count board layouts.
  • Industrial Temperature Grade  Rated for -40 °C to 100 °C operation to meet the environmental demands of industrial applications.
  • Regulatory Compliance  RoHS compliant for lead‑free assembly and environmental compliance in many production environments.

Typical Applications

  • Industrial Control Systems  Implement complex control logic, bus bridging and on‑board data buffering using the device's large logic and memory resources within industrial temperature environments.
  • High‑I/O Interface Hubs  Aggregate and route signals across multiple interfaces or sensor arrays leveraging the 920 available user I/O pins.
  • Embedded Processing and Acceleration  Deploy custom datapaths and hardware accelerators that take advantage of extensive logic elements and embedded RAM for local storage and pipelining.

Unique Advantages

  • Substantial Logic Density: 291,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing board‑level component count.
  • Significant On‑Chip Memory: Approximately 17.66 Mbits of embedded RAM lowers reliance on external memory for many buffering and storage tasks, simplifying BOM and layout.
  • Extensive External Connectivity: 920 user I/Os support complex system interconnects and high channel counts without additional multiplexing hardware.
  • Industrial Reliability: Rated for -40 °C to 100 °C, the device is suited to harsher operating environments common in industrial applications.
  • Compact High‑Pin Package: 1932‑ball FCBGA in a 45 × 45 mm package delivers high pin density in a board‑friendly surface mount form factor.
  • RoHS Compliance: Lead‑free device qualification supports environmentally conscious manufacturing and regulatory needs.

Why Choose EP4SGX290NF45I3?

The EP4SGX290NF45I3 provides a balanced combination of high logic capacity, sizeable embedded memory and an exceptional I/O count, packaged for surface‑mount assembly and rated for industrial temperature operation. These attributes make it well suited to designers building large, I/O‑intensive embedded systems that require consolidated functionality on a single FPGA.

Backed by the Stratix® IV GX family lineage and manufactured by Intel, the device offers a platform for scalable designs where on‑chip resources and industrial robustness reduce system complexity and support long‑term deployment.

Request a quote or submit an inquiry to discuss pricing, availability and how EP4SGX290NF45I3 can be integrated into your next design.

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