EP4SGX290NF45I3
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 17661952 291200 1932-BBGA, FCBGA |
|---|---|
| Quantity | 946 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 920 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11648 | Number of Logic Elements/Cells | 291200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17661952 |
Overview of EP4SGX290NF45I3 – Stratix® IV GX Field Programmable Gate Array (FPGA)
The EP4SGX290NF45I3 is a Stratix® IV GX FPGA offering a high-density programmable fabric optimized for complex, I/O‑heavy industrial designs. It combines 291,200 logic elements with approximately 17.66 Mbits of embedded memory and 920 user I/O to support large-scale digital logic, buffering and interface integration.
Designed for surface‑mount deployment, this device operates from a core supply range of 0.87–0.93 V and is rated for industrial temperature operation from -40 °C to 100 °C, making it suitable for robust embedded applications that require significant logic capacity and on‑chip memory.
Key Features
- Logic Capacity 291,200 logic elements provide substantial programmable resources for complex state machines, datapath logic and custom compute blocks.
- Embedded Memory Approximately 17.66 Mbits of on‑chip RAM to support buffering, FIFOs and local data storage without external memory in many designs.
- High I/O Count 920 user I/O pins enable extensive external interfacing for multi‑lane transceivers, parallel buses, or mixed signal front‑ends.
- Power and Core Voltage Core supply range of 0.87–0.93 V allows precise power provisioning for the FPGA fabric.
- Package and Mounting 1932‑ball BGA (FCBGA), 45 × 45 mm footprint in a surface‑mount package for compact, high‑pin‑count board layouts.
- Industrial Temperature Grade Rated for -40 °C to 100 °C operation to meet the environmental demands of industrial applications.
- Regulatory Compliance RoHS compliant for lead‑free assembly and environmental compliance in many production environments.
Typical Applications
- Industrial Control Systems Implement complex control logic, bus bridging and on‑board data buffering using the device's large logic and memory resources within industrial temperature environments.
- High‑I/O Interface Hubs Aggregate and route signals across multiple interfaces or sensor arrays leveraging the 920 available user I/O pins.
- Embedded Processing and Acceleration Deploy custom datapaths and hardware accelerators that take advantage of extensive logic elements and embedded RAM for local storage and pipelining.
Unique Advantages
- Substantial Logic Density: 291,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing board‑level component count.
- Significant On‑Chip Memory: Approximately 17.66 Mbits of embedded RAM lowers reliance on external memory for many buffering and storage tasks, simplifying BOM and layout.
- Extensive External Connectivity: 920 user I/Os support complex system interconnects and high channel counts without additional multiplexing hardware.
- Industrial Reliability: Rated for -40 °C to 100 °C, the device is suited to harsher operating environments common in industrial applications.
- Compact High‑Pin Package: 1932‑ball FCBGA in a 45 × 45 mm package delivers high pin density in a board‑friendly surface mount form factor.
- RoHS Compliance: Lead‑free device qualification supports environmentally conscious manufacturing and regulatory needs.
Why Choose EP4SGX290NF45I3?
The EP4SGX290NF45I3 provides a balanced combination of high logic capacity, sizeable embedded memory and an exceptional I/O count, packaged for surface‑mount assembly and rated for industrial temperature operation. These attributes make it well suited to designers building large, I/O‑intensive embedded systems that require consolidated functionality on a single FPGA.
Backed by the Stratix® IV GX family lineage and manufactured by Intel, the device offers a platform for scalable designs where on‑chip resources and industrial robustness reduce system complexity and support long‑term deployment.
Request a quote or submit an inquiry to discuss pricing, availability and how EP4SGX290NF45I3 can be integrated into your next design.

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